Optical Chip Package Assembly With Positioning Pattern Alignment
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Solution Overview
Problem
Existing electronic housings with encapsulation covers for chips on carrier wafers face challenges in precise and efficient assembly, particularly in aligning optical components for light transmission and fixation, which affects the accuracy and reliability of the device.
Innovation Solution
The solution involves an electronic device design with a carrier substrate, an encapsulation cover, and an optical element that includes a positioning pattern and adhesive drops to facilitate precise alignment and mounting, ensuring the optical axes of the chip and optical element are on a common axis, using a combination of materials like glass wafers and structured polymers for light deviation and a bead of adhesive for secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional assembly methods are used for mounting optical components on carrier wafers, then the assembly process is simpler, but the alignment precision and positioning accuracy of optical components deteriorate
Solution Approach 1:
Positioning patterns are pre-formed on the carrier wafer before optical component assembly. These patterns serve as alignment references that guide the precise positioning of optical components during assembly, eliminating the need for complex real-time alignment procedures while ensuring high positioning accuracy.
Solution Approach 2:
The positioning pattern acts as an intermediary element between the carrier wafer and the optical component. It provides a common reference framework that enables precise alignment without requiring direct complex mechanical adjustments between the wafer and optical components.
2Manufacturing precision
If precise alignment methods are implemented for optical components, then the optical axis alignment improves, but the assembly time and production efficiency deteriorate
Solution Approach 1:
The positioning pattern is created during the wafer fabrication process before assembly begins. This preliminary action ensures that alignment references are already in place, allowing optical components to be quickly positioned using these pre-established patterns without requiring time-consuming alignment procedures during assembly.
Solution Approach 2:
The positioning pattern enables the assembly process to be self-aligning. The optical component can be positioned by simply matching its features with the pre-formed positioning pattern, allowing the system to self-correct alignment without external intervention or complex alignment equipment.
3Strength
If complex fixation structures are used to secure optical elements, then the bonding strength improves, but the assembly complexity and difficulty of positioning patterns deteriorate
Solution Approach 1:
Instead of using complex fixation structures across the entire optical element, adhesive is applied only at specific localized positions indicated by the positioning pattern. This local quality approach provides sufficient bonding strength at critical points while keeping the overall fixation structure simple and easy to implement.
Solution Approach 2:
The positioning pattern serves as an intermediary that guides adhesive application. It marks the exact locations where adhesive should be placed, ensuring optimal bonding strength without requiring complex fixation mechanisms. The pattern translates the need for strong bonding into simple, localized adhesive application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the assembly precision and reliability by ensuring correct optical alignment and secure fixation, allowing for effective light transmission and improved device performance, such as in proximity detection applications.
Implementation Method 1
an optical element, designed to allow light to pass, which covers the front opening of the encapsulation cover
Implementation Method 2
At least one drop of adhesive for fixing the optical element may extend locally into the local cavity
Data Source
AI summary
An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.