Optical Chip Package with Step-Shaped Sidewall for Dicing
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Solution Overview
Problem
The brittleness of glass wafers in optical chip packages leads to easy chipping during the dicing process, resulting in reduced yield due to the fragility of the materials used in current fabrication methods.
Innovation Solution
A method involving a spacer layer between two transparent substrates with different thicknesses, where a recess region extends from one substrate into the other, allowing for a step-shaped sidewall and enabling a multi-step dicing process using different dicing saws to minimize chipping and improve stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If glass wafers are diced using conventional methods, then individual optical chip packages are formed, but the glass wafers are brittle and easily broken causing chipping
Solution Approach 1:
A support structure comprising a support substrate and a support layer is provided beforehand to cushion and support the glass wafer during the dicing process. The support layer is positioned between the glass wafer and the support substrate, preventing direct contact and reducing mechanical stress that causes chipping. This prior cushioning measure protects the brittle glass wafer from damage during conventional dicing operations.
2Productivity
If the glass wafer is diced to form individual packages, then the optical chip package is fabricated, but the edge of the optical chip package breaks easily reducing yield
Solution Approach 1:
The support structure is prepared in advance before the dicing process to prevent edge breakage. The support layer acts as a cushion that distributes cutting forces and prevents stress concentration at the edges during dicing, thereby maintaining edge quality and reducing breakage while enabling efficient fabrication.
3Reliability
If additional carrier substrates are used to prevent chipping, then chip integrity is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The support structure is segmented into distinct functional components: a support substrate providing mechanical strength and a support layer providing cushioning protection. This segmentation allows each component to perform its specific function optimally while keeping the overall structure manageable and not excessively complex.
Solution Approach 2:
The support layer acts as an intermediary element between the glass wafer and the support substrate. This intermediary layer provides the necessary cushioning and protection without requiring the glass wafer to directly contact the rigid support substrate, thereby preventing chipping while maintaining structural integrity.
Data Source
AI summary
An optical chip package is provided. The optical chip package includes a first transparent substrate, a second transparent substrate, and a spacer layer. The first and second transparent substrates each has a first surface and a second surface opposite the first surface. The first transparent substrate has a thickness that is different than that of the second transparent substrate. The second transparent substrate is disposed over the first transparent substrate, and the spacer layer is bonded between the second surface of the first transparent substrate and the first surface of the second transparent substrate. The recess region extends from the second surface of the second transparent substrate into the first transparent substrate, so that the first transparent substrate has a step-shaped sidewall. A method of forming an optical chip package is also provided.