Hermetic Optical Chip Packaging With Ceramic-Metal Heat Dissipation
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Solution Overview
Problem
Existing LiDAR systems face challenges in heat dissipation due to significant heat generation by components, leading to potential yield issues.
Innovation Solution
An optical chip packaging module with a carrier board and light-transmitting cover plate forming a hermetic space, utilizing thermally conductive materials like ceramic and metal to rapidly dissipate heat from the optical chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging materials are used, then manufacturing simplicity is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The patent employs composite material construction for the carrier board, integrating ceramic substrates (providing thermal conductivity and electrical insulation) with metal layers (providing structural strength and additional thermal pathways). This composite approach enables superior heat dissipation while maintaining manufacturing feasibility through established multi-layer PCB fabrication processes.
2Temperature
If thermally conductive materials are added to the carrier board, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The thermally conductive materials and heat dissipation structures are pre-integrated into the carrier board during its fabrication process, before the optical chip is mounted. The multi-layer ceramic and metal structure is prepared in advance with predetermined thermal pathways, eliminating the need for additional heat dissipation components or complex post-assembly modifications.
Solution Approach 2:
The patent merges the structural support function and heat dissipation function into a single integrated carrier board structure. The ceramic and metal layers simultaneously provide mechanical support for the optical chip and create thermal conduction pathways, combining multiple functions into one component to reduce overall manufacturing complexity.
3Productivity
If high thermal conductivity materials are used, then heat dissipation speed is improved, but material cost and processing difficulty increase
Solution Approach 1:
The patent uses ceramic materials (such as aluminum oxide or aluminum nitride) that offer high thermal conductivity comparable to metals but with superior electrical insulation properties. The ceramic layers are bonded with conductive adhesives or solder to create thermal pathways, achieving rapid heat dissipation while avoiding the processing difficulties and cost associated with pure metal heat sinks.
Solution Approach 2:
The patent introduces ceramic substrates as intermediary materials between the optical chip and the external environment. These ceramics serve as thermal mediators that conduct heat away from the chip while providing electrical isolation, and they can be bonded using standard semiconductor packaging techniques such as eutectic bonding or conductive adhesive bonding, which are well-established in the industry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures rapid heat dissipation and enhances the yield of the optical chip packaging module by effectively managing heat generated by high-heat components.
Implementation Method 1
the carrier board includes a thermally conductive material in contact with the optical chip
Data Source
AI summary
An optical chip packaging module, an optical module, and a LiDAR are provided. The optical chip packaging module includes a carrier board and a light-transmitting cover plate covering the carrier board, forming a hermetic space between the carrier board and the light-transmitting cover plate. Within the hermetic space, an optical chip is fixed on the carrier board. The carrier board includes a thermally conductive material in contact with the optical chip, where the thermally conductive material includes ceramic material and/or metal material.