Optical Circuit Thermal Management via Diamond Over Cladding

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Solution Overview

Problem

In optical circuit devices, temperature inconsistencies caused by joule heating due to current flow lead to poor signal reliability and degraded modulation capabilities, as the refractive index of semiconductor core materials changes with temperature variations.

Innovation Solution

A thermally controlled optical circuit design featuring a waveguide between a base cladding and an over cladding, where the over cladding is made of a high thermal conductivity dielectric material, such as diamond, to distribute heat evenly and maintain consistent temperatures along the optical pathway, thereby reducing temperature variations and enhancing signal modulation reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If current flow is used for signal modulation in the waveguide, then modulation capability is improved, but temperature inconsistency increases due to joule heating

Engineering Contradiction:
Improvesignal modulation capabilityVSAvoidtemperature consistency
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

A thermally conductive layer is introduced as an intermediary component between the waveguide and the substrate. This layer acts as a heat transfer mediator that conducts away joule heating generated during signal modulation, preventing temperature buildup while allowing the modulation function to continue operating.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful thermal effect (joule heating) is extracted and separated from the modulation function by introducing a dedicated thermal management layer. This layer specifically addresses the temperature inconsistency problem without interfering with the electrical modulation capability of the waveguide.

Inventive Principle:
Principle #2Taking out (Extraction)

2Temperature

If high thermal conductivity material is used for over cladding, then temperature consistency is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature consistencyVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The thermal conductivity parameter of the over cladding material is changed from standard dielectric values to high thermal conductivity values. This parameter change enables effective heat distribution and temperature consistency without requiring complex active cooling systems or multiple functional layers.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9581761B2Controlling temperatures in optical circuits
Publication Date: 2017.02.28 HEWLETT PACKARD ENTERPRISE DEV LP
  • US9581761B2 patent drawing
  • US9581761B2 patent drawing
  • US9581761B2 patent drawing

AI summary

Controlling temperatures in optical circuits includes using a device with a waveguide located between a base cladding and an over cladding. The base cladding is deposited over a substrate and the over cladding is made of a thermally conductive dielectric material.