Optical Circuit Lid Thermal Management
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Solution Overview
Problem
The integration of electric and optical circuits in a stack configuration using OBO technology faces challenges in efficient heat dissipation, as optical parts are positioned away from the substrate, making it difficult to regulate temperature accurately, which affects the performance of optical transceivers.
Innovation Solution
An optical circuit with a lid that includes temperature control elements, such as a Peltier element, is used to seal and regulate the temperature of the optical circuit, allowing for efficient heat management and stabilization of optical parts by integrating the lid with a metal plate and optical fiber arrays for enhanced thermal conductivity and optical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical parts are positioned away from the substrate to enable stack configuration, then integration density is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces a vertical stacking dimension to arrange optical and electric circuit portions in layers, increasing integration density while managing heat through vertical separation. The lid structure provides a third dimension for heat dissipation pathways.
Solution Approach 2:
The patent introduces a lid as an intermediary structure that seals the optical circuit and provides a dedicated heat dissipation pathway. The lid acts as a mediator between the stacked optical components and the external environment, enabling controlled thermal management.
2Ease of manufacture
If optical parts are positioned away from the substrate, then manufacturing flexibility is improved, but temperature regulation accuracy deteriorates
Solution Approach 1:
The lid serves multiple functions simultaneously: it seals the optical circuit, provides structural support for the stack configuration, and acts as a heat dissipation component. This multi-functionality maintains manufacturing flexibility while enabling temperature regulation.
Solution Approach 2:
The patent applies different properties to different regions of the optical circuit structure. The lid has specific thermal properties optimized for heat dissipation, while the substrate maintains electrical properties. This localized optimization enables both manufacturing flexibility and temperature regulation accuracy.
3Temperature
If lid is added to seal the optical circuit, then temperature regulation is improved, but device complexity increases
Solution Approach 1:
The patent merges the sealing function and heat dissipation function into a single lid structure. This consolidation achieves temperature regulation without proportionally increasing device complexity, as the lid integrates multiple functions that would otherwise require separate components.
Solution Approach 2:
The lid is designed as a multi-functional component that simultaneously provides sealing, structural support, and heat dissipation. This universality reduces the overall device complexity compared to having separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides efficient temperature regulation for optical circuits, preventing property degradation and ensuring stable operation by effectively managing heat generated by the optical parts, even under varying ambient temperatures.
Implementation Method 1
temperature control elements being in contact with the optical circuit portion
Implementation Method 2
temperature control elements, such as a Peltier element
Data Source
AI summary
An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.