Optical Circuit Sidewall Port for Passive PIC Alignment
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Solution Overview
Problem
Existing optical circuits face challenges in achieving efficient coupling between photonic integrated circuits (PICs) and fibers due to tight mechanical tolerances required for low optical loss.
Innovation Solution
The optical circuit employs a substrate with an integrated optical path and self-alignment features, allowing the PIC to align passively in three dimensions using surface tension self-alignment features and reference surfaces, eliminating the need for active alignment techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If active alignment techniques are used to couple PIC and fiber, then coupling efficiency can be improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The substrate performs self-alignment through integrated surface tension self-alignment features that automatically position the PIC relative to the optical path without requiring external active alignment equipment or complex adjustment mechanisms. The substrate's own structural features enable precise passive alignment during wafer-level processing.
Solution Approach 2:
The self-alignment features are pre-integrated into the substrate structure during manufacturing, establishing precise positional relationships before the PIC is mounted. This preliminary alignment configuration eliminates the need for subsequent active alignment steps and reduces assembly complexity.
2Loss of energy
If tight mechanical tolerances are enforced for efficient coupling, then optical loss is reduced, but manufacturing difficulty increases
Solution Approach 1:
The substrate uses its own surface tension self-alignment features to automatically achieve tight tolerances during wafer-level processing. The self-alignment mechanism eliminates the need for complex external alignment equipment and manual adjustment, making it easier to manufacture while maintaining precise positional tolerances.
Solution Approach 2:
The patent replaces complex mechanical alignment systems with surface tension-based self-alignment features. This substitution of mechanical alignment mechanisms with surface tension forces simplifies the manufacturing process while achieving the required tight tolerances for efficient optical coupling.
3Ease of manufacture
If passive alignment with surface tension features is used, then manufacturing cost is reduced, but alignment precision must be maintained
Solution Approach 1:
The substrate's surface tension self-alignment features automatically maintain precise alignment during wafer-level processing without requiring expensive active alignment equipment. The self-alignment mechanism inherently ensures manufacturing precision while reducing overall manufacturing cost by eliminating complex alignment systems.
Solution Approach 2:
The patent replaces expensive mechanical alignment systems with surface tension-based self-alignment features. This substitution maintains high alignment precision through the physical properties of surface tension while significantly reducing manufacturing cost by eliminating the need for complex external alignment equipment and procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves precise alignment of the PIC with respect to the substrate, resulting in reduced optical loss and improved coupling efficiency between the PIC and the fiber, while also offering cost savings through wafer-level processing and assembly.
Implementation Method 1
The PIC can attach to the substrate using surface tension self-alignment features to achieve alignment in a lateral plane
Data Source
AI summary
In an optical circuit, a substrate can define a cavity that extends into a substrate front surface. A sidewall of the cavity can include a substrate optical port. An optical path can extend through the substrate from a connector optical port to the substrate optical port. A photonic integrated circuit (PIC) can attach to the substrate. A PIC front surface can include a plurality of electrical connections. A PIC edge surface can extend around at least a portion of a perimeter of the PIC between the PIC front surface and a PIC back surface. A PIC optical port can be disposed on the PIC edge surface and can accept or emit an optical beam along a PIC optical axis. The PIC optical axis can be aligned with the substrate optical port when the PIC is attached to the substrate.