Optical Semiconductor End-Face Coating Shield for Wraparound Control
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Solution Overview
Problem
Existing optical semiconductor devices face challenges in preventing coating wraparound on surfaces other than the end face during the coating process, leading to assembly failures and increased processing costs due to complex groove formation and resin layer control.
Innovation Solution
The optical semiconductor device incorporates a support member with a flat surface and a shielding mechanism that extends between the mounting surface and the bonding surface, preventing coating wraparound by stabilizing the dummy bar and covering the region where the bonding surface is formed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a groove is provided in the dummy bar to suppress coating wraparound, then coating wraparound is suppressed, but processing cost increases significantly due to additional grooving operations
Solution Approach 1:
The invention extracts the wraparound suppression function from the dummy bar itself and transfers it to a separate support member. The support member is positioned between the dummy bar and the bonding surface, providing the necessary shielding without requiring any modification to the dummy bar structure. This eliminates the need for costly grooving operations on the dummy bar while maintaining effective wraparound suppression.
Solution Approach 2:
The support member acts as an intermediary element between the dummy bar and the bonding surface. It provides the shielding function that was previously attempted to be integrated into the dummy bar, but does so as a separate component that can be easily positioned and removed, avoiding permanent modifications to the dummy bar and reducing manufacturing complexity.
2Reliability
If a groove is provided in the dummy bar to suppress coating wraparound, then coating wraparound is suppressed, but the degree of difficulty in arranging the bar increases very high
Solution Approach 1:
The invention extracts the wraparound suppression function from the dummy bar and places it in a separate support member. This allows the dummy bar to maintain its simple, unmodified structure, making it easy to handle and arrange. The support member, which contains the shielding structure, is independently positioned to provide the necessary protection without complicating the dummy bar arrangement process.
Solution Approach 2:
The invention segments the wraparound suppression function from the dummy bar structure and implements it in a separate support member. This segmentation allows each component to be optimized independently - the dummy bar for easy handling and the support member for effective shielding - thereby reducing the overall complexity of the arrangement process.
3Reliability
If a resin layer with recessed shape is formed as under layer for electrode pad to prevent coating wraparound, then coating wraparound is prevented, but it is difficult to control the recessed shape and obtain reproducibility
Solution Approach 1:
The support member functions as a temporary, disposable shielding structure that is used only during the coating process. It can be easily positioned and then removed, providing reliable wraparound prevention without requiring permanent modifications to the device structure. This approach avoids the reproducibility issues associated with forming precise recessed shapes in resin layers, as the support member's shielding geometry is simply positioned rather than formed through complex manufacturing processes.
Solution Approach 2:
The support member serves as an intermediary shielding structure that provides consistent and reproducible wraparound prevention. Unlike resin layers where the recessed shape must be precisely controlled during formation, the support member's shielding geometry can be pre-fabricated with high precision and then simply positioned during assembly, thereby achieving better reproducibility across manufacturing batches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the optical semiconductor device to reliably prevent coating wraparound with good reproducibility, reducing processing costs and assembly failures while maintaining the integrity of the device.
Implementation Method 1
a reflective film covering both end faces of the semiconductor layer in the extending direction of the resonator
Data Source
AI summary
An optical semiconductor device comprises: a semiconductor layer in which a resonator is formed; a reflective film covering both end faces of the semiconductor layer; an electrode pad formed by stacking metal layers; a support member arranged in each of positions on a mounting surface close to both the end faces, having a support face with a maximum height from the mounting surface and supporting a holder when the reflective film is coated; and a shield in which a portion higher than a bonding surface extends between each of sides of the mounting surface that are adjacent to both the end faces and the bonding surface so as to cover a region in which the bonding surface is formed in a left-right direction.