Optical Communication Connection Interface for Compact SMT Assembly
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Solution Overview
Problem
Current optic-connecting devices in optical communication are large-sized, posing a challenge for assembly in computers and compromising high-frequency characteristics.
Innovation Solution
The optical communication connection device employs a connection interface connected to an external circuit board via surface mount technology, with connection terminals approximately parallel to the board surface, and an angle between terminals ranging from 45 to 135 degrees, along with a supporting frame or thermal column to enhance high-frequency characteristics and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional optic-connecting devices are used, then optical signal transmission is achieved, but the device size is large which compromises assembly in computers
Solution Approach 1:
The connection interface is rotated 45 to 135 degrees relative to the circuit board surface, transitioning from a traditional perpendicular mounting to an angled configuration. This dimensional change allows the device to fit into compact computer assemblies while maintaining proper electrical and optical connections
2Reliability
If connection terminals are perpendicular to the circuit board, then traditional mounting is achieved, but high-frequency characteristics are compromised
Solution Approach 1:
The connection interface angle parameter is changed from the traditional 90 degrees (perpendicular) to a range of 45 to 135 degrees. This parameter modification optimizes the electromagnetic signal transmission path, reducing signal reflection and impedance discontinuity, thereby improving high-frequency characteristics
3Volume of moving object
If surface mount technology is used for connection terminals, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The connection interface is designed to serve multiple functions: it provides mechanical support, electrical connection, and optical signal transmission all at an angled orientation. This multi-functional design allows surface mount technology to be effectively applied while maintaining proper signal integrity and structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the device size and improves high-frequency performance, facilitating easier assembly and better signal transmission.
Implementation Method 1
a first heat conduction layer disposed on a surface of the at least one chip or the circuit board
Data Source
AI summary
The invention relates to an optical communication connection device, which includes an optical receiving unit, an optical transmitting unit, a circuit board and a connection interface. The optical receiving unit and the optical transmitting unit are connected to the connection interface through the circuit board, and the connection interface is used to connect to an external circuit board. The connection interface has a plurality of first connection terminals connected to the circuit board and a plurality of second connection terminals being used to connect to the external circuit board. The second connection terminal is substantially parallel to the external circuit board, and is connected to the external circuit board through surface mount technology, which is not only conducive to reduce the size of the optical communication connection device, but also improve the high-frequency characteristics thereof.