Optical Component with Integrated Conductive Layers for Detachment Detection
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Solution Overview
Problem
Conventional optical modules lack a mechanism to detect when the optical component detaches from the bracket, leading to potential damage due to shaking or collision, as they do not have any design for monitoring this detachment.
Innovation Solution
Incorporating light-transmissive conductive layers on the optical component that are electrically connected to conductive layers on the bracket, allowing the circuit to detect detachment and initiate protection measures by monitoring electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional optical modules are used without detachment detection design, then the structure is simple, but the reliability deteriorates because the optical component can loosen or detach without detection
Solution Approach 1:
The patent combines the detachment detection function with the existing optical component structure by integrating light-transmissive conductive layers into the optical component body and connecting them to the circuit board. This merging approach enables detection capability without adding separate complex detection systems, thus improving reliability while minimizing structural complexity.
Solution Approach 2:
The optical component serves multiple functions: it performs its primary optical function (light transmission, focusing, or sensing) while simultaneously acting as a detection element through the integrated light-transmissive conductive layers. When the optical component detaches, the electrical connection through these layers changes, providing detachment detection. This multi-functionality improves reliability without requiring additional dedicated detection components.
2Reliability
If light-transmissive conductive layers are added to enable detachment detection, then the reliability improves, but the manufacturing complexity increases
Solution Approach 1:
The light-transmissive conductive layers are integrated directly into the optical component body during the manufacturing process, combining the optical component fabrication with the conductive layer deposition. This merging eliminates the need for separate assembly steps to install detection elements, thereby improving reliability while minimizing the increase in manufacturing complexity.
3Measurement precision
If the optical component is made with conductive layers for detection, then the detection precision improves, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive layers are formed as integral parts of the optical component body using the same manufacturing processes, ensuring that the conductive layer positions are automatically aligned with the optical component features. This integrated formation approach achieves precise detection capability without requiring separate high-precision positioning steps, thus improving measurement precision while controlling manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the detection of optical component detachment, preventing damage to the chip component by shutting down the driving circuit when the optical component is loosened or detached, thus ensuring the optical module's operational safety.
Implementation Method 1
The at least one light-transmissive conductive layer is electrically connected to the circuit board
Data Source
AI summary
An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.