Optical Component With Molded Guide Unit For Fiber Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical fiber connection techniques for optical communication systems are costly and lack accuracy in mounting, particularly when using wafer-level packaging (WLP) for on-board optics (OBO), where optical components need to be precisely aligned and coupled with optical fibers.
Innovation Solution
An optical component design featuring an optical element with a light incidence/emission unit on a side surface and an optical coupling element with a guide unit on the substrate, where the guide unit extends parallel to the substrate to fix an optical fiber, and a mold resin layer covers the optical element, exposing the optical coupling element at one end, allowing for precise alignment and optical coupling without increasing mounting costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional optical fiber connection techniques are used, then optical coupling can be achieved, but mounting cost increases and alignment precision deteriorates
Solution Approach 1:
The patent combines the optical fiber fixing function and the optical coupling function into a single integrated optical coupling element. This element includes a guide unit for fixing the optical fiber and a coupling unit for optical coupling, eliminating the need for separate mounting steps and reducing overall mounting cost while maintaining high alignment precision through the integrated design
Solution Approach 2:
The optical coupling element is prepared in advance with the guide unit and coupling unit integrated together. The guide unit is designed to pre-position the optical fiber, and the coupling unit is pre-configured to achieve precise optical coupling. This preliminary integration eliminates the need for costly and complex alignment operations during final assembly
2Ease of manufacture
If wafer-level packaging is used for on-board optics, then mounting cost reduces, but alignment precision of optical components deteriorates
Solution Approach 1:
The patent transitions from traditional planar wafer-level packaging to a three-dimensional structure where the optical coupling element extends vertically from the substrate. The guide unit and coupling unit are arranged in different spatial dimensions, allowing precise optical coupling to be achieved through vertical stacking rather than planar alignment, thereby maintaining high precision while benefiting from WLP cost advantages
3Adaptability or versatility
If optical components are mounted separately, then flexibility in disposition is improved, but device complexity increases
Solution Approach 1:
The optical coupling element is designed as a universal component that performs multiple functions: it fixes the optical fiber through the guide unit, achieves optical coupling through the coupling unit, and can be mounted on the substrate in various positions. This multi-functional design eliminates the need for separate mounting of multiple components, reducing device complexity while maintaining disposition flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables highly accurate optical coupling with optical fibers in OBO systems using WLP, reducing mounting costs and improving alignment precision, thus enhancing the efficiency and reliability of optical communication systems.
Implementation Method 1
a mold resin layer 105 is formed so as to cover the optical element 102 and expose a side surface of the optical coupling element 103
Data Source
AI summary
There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.