Optical Component Vertical Transmission Through-Hole Integration

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Solution Overview

Problem

Conventional optical-electro circuit boards face challenges with light loss and reduced optical efficiency due to the need for large layout space and inaccurate surface features of optical waveguide elements, which affect light beam transmission.

Innovation Solution

A multi-layer substrate with through holes and optical-electro assemblies inserted at opposite ends of an optical waveguide element, where one assembly transforms electrical signals into light beams and the other receives light beams, reducing light loss by optimizing the transmission path within a groove on the circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If optical waveguide elements with inclined surfaces are used to change light transmission path, then optical-electro conversion function is achieved, but light loss increases and optical efficiency decreases

Engineering Contradiction:

Improveoptical-electro conversion functionVSAvoidlight loss

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

Instead of using inclined surfaces to change light transmission path, the patent inverts the approach by using vertical transmission through through-holes. The optical waveguide element transmits light vertically from one surface to the opposite surface, eliminating the need for inclined surfaces and reducing light loss while achieving the same optical-electro conversion function.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the transmission path parameter from inclined (45-degree) to vertical. By modifying the light transmission path from oblique to perpendicular through the through-hole structure, the optical efficiency is improved and light loss is reduced while maintaining the optical-electro conversion capability.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If multiple elements are arranged on multi-layer circuit board, then optical-electro conversion function is achieved, but layout space increases

Engineering Contradiction:

Improveoptical-electro conversion functionVSAvoidlayout space

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent embeds the optical waveguide element within the multi-layer circuit board structure using through-holes that pass through dielectric layers. The optical-electro elements are positioned at opposite ends of the through-holes, nesting the optical transmission path within the existing circuit board layers, thereby reducing the required layout space while maintaining full optical-electro conversion functionality.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from surface-level arrangement of optical elements to three-dimensional integration through the circuit board thickness. By utilizing the vertical dimension with through-holes passing through multiple dielectric layers, the optical transmission path is established in the Z-direction, reducing the footprint area required on the circuit board surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances optical efficiency and reduces the required surface layout space, allowing for more compact and efficient optical-electro circuit boards.

Implementation Method 1

an optical waveguide element is formed on a surface of the multi-layer substrate and between the through holes... One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS9739963B2Manufacturing method of optical component

Publication Date: 2017.08.22 UNIMICRON TECH CORP

AI summary

An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.