Optical Component Transfer Alignment Without Moving Heavy Substrates
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Solution Overview
Problem
The high inertial mass associated with traditional laser die transfer systems limits the throughput of electronic component transfer, as it requires significant movement of both the source and target substrates, making it difficult to achieve efficient alignment and transfer of components.
Innovation Solution
An electronic component transfer system utilizing an optical light source with a movable drive unit and controller to optimize the alignment and release of components, reducing the inertial mass by moving the light source and light beam instead of the substrates, allowing for faster and more efficient component transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the source carrier and target carrier are moved to align components with target positions, then component transfer alignment is achieved, but the high inertial mass limits the throughput and transfer speed
Solution Approach 1:
The patent replaces the mechanical movement of heavy carriers with an optical system. Instead of moving the source and target carriers to achieve alignment, a movable optical light source is used to selectively release components at different positions. This substitutes mechanical translation with optical positioning, dramatically reducing the moving mass while maintaining alignment capability.
Solution Approach 2:
The patent segments the alignment function from the carrier movement. Rather than moving the entire carrier system for alignment, the optical light source is independently movable and can be positioned to release individual components at specific target locations. This segmentation allows the heavy carriers to remain stationary while the lightweight optical system handles the positioning task.
2Productivity
If the optical light source is moved to release components at different positions, then the inertial mass is reduced and throughput is improved, but the complexity of the drive system increases
Solution Approach 1:
The patent introduces dynamic positioning of the optical light source to replace static carrier movement. The optical system is mounted on a movable platform that can dynamically adjust its position to release components at different target locations. This dynamic approach allows the system to achieve high throughput by quickly repositioning the lightweight optical source rather than moving heavy carriers.
3Manufacturing precision
If the source substrate and target substrate are moved for alignment, then component positioning accuracy is achieved, but the transfer time increases due to the mass of the substrates
Solution Approach 1:
The patent replaces mechanical substrate movement with optical positioning. The movable optical light source can quickly jump to different positions to release components with high precision, eliminating the need to physically move the heavy substrates for alignment. This achieves both high positioning accuracy and reduced alignment time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the throughput by minimizing the time required to align components with target positions, enabling faster and more efficient transfer of electronic components with reduced inertial mass, thereby improving the overall transfer process.
Implementation Method 1
a source substrate 220 is in the form of a semiconductor wafer that consists of singulated semiconductor dies 221 mounted on a foil 222 using an adhesive 223... Using laser light 150, solder paste 121 is released from cavities 122 and is propelled towards a target substrate 140... The ablation of the release material causes the semiconductor die to be propelled from the carrier foil towards a target substrate
Data Source
AI summary
Aspects of the present disclosure relate to an electronic component transfer system. Further aspects of the present disclosure relate to a method for transferring an electronic component. The present disclosure particularly relates to electronic component transfer systems in which an optical light source is used for releasing and transferring electronic components. According to an aspect of the present disclosure, a drive unit is used for moving the optical light source and/or light beam output by the optical light source to change a position at which it has released a component from the source substrate to a position at which it will release a next component from the source substrate.