Optical Connecting Device Thermal Stress Management
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Solution Overview
Problem
Optical fiber arrays in existing technologies are not heat-resistant enough to withstand the thermal stress of solder reflow processes due to differences in thermal expansion coefficients between guide pins and holders, leading to separation of substrates during heat treatment.
Innovation Solution
An optical connecting device with a holder comprising a first resin body, a second resin body, a supporting part, and a first lid part, where the guide part is supported in a groove by the first and second faces, and the first lid part is separated from the guide part to prevent thermal deformation from transferring, using materials with different thermal expansion coefficients for the guide part and the support parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If guide pins and holders are made of different materials to achieve proper optical coupling, then optical coupling precision is improved, but thermal expansion coefficient differences cause substrate separation during solder reflow
Solution Approach 1:
The holder is divided into multiple resin bodies (first resin body and second resin body) that can be separately positioned and cured. The first resin body positions the optical fiber between the supporting part and first lid part, while the second resin body bonds the guide part to the supporting part. This segmentation allows each resin body to be optimized for its specific function, preventing substrate separation during thermal processes while maintaining optical coupling precision.
Solution Approach 2:
Different regions of the holder are assigned different materials and functions: the supporting part provides structural support, the first resin body provides precise positioning for optical coupling, and the second resin body provides bonding for the guide part. This local differentiation allows each component to have optimized properties for its specific function, resolving the contradiction between optical precision and thermal stability.
2Device complexity
If the first lid part is placed close to the guide part for compact structure, then device complexity is reduced, but thermal deformation of the guide part transfers to the optical fiber positioning
Solution Approach 1:
The holder is segmented into distinct functional zones: the first resin body zone for optical fiber positioning, the second resin body zone for guide part bonding, and the groove zone for guide part support. This spatial segmentation isolates the thermal deformation of the guide part from the optical fiber positioning area, maintaining positioning precision while keeping the overall structure compact.
Solution Approach 2:
The groove acts as an intermediary structure between the guide part and the optical fiber positioning area. It supports the guide part while physically separating it from the optical fiber path, preventing thermal deformation transfer. The first and second resin bodies serve as intermediaries that bond components without creating rigid connections that would transmit thermal stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical connecting device provides excellent heat resistance, allowing it to withstand solder reflow processes without substrate separation, maintaining optical coupling between the optical connecting device and silicon photonics devices.
Implementation Method 1
due to differences in thermal expansion coefficients between guide pins and holders
Data Source
AI summary
An optical connecting device includes: a holder; an optical fiber supported by the holder; and a guide part supported by the holder. The holder includes first and second resin bodies arranged apart from each other, a supporting part, and a first lid part, a supporting groove, and a groove. The connecting device features: the first resin body being in contact with the optical fiber between the supporting part and the first lid part, the guide part being supported in the groove, the second resin body bonding the guide part to the supporting part, the optical fiber extending in the support groove in the principal surface of the supporting part, and the first lid part being disposed apart from the guide part on the optical fiber, and the optical fiber being between the supporting part and the first lid part.