Optical Connection Element for Photonic Packaging
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Solution Overview
Problem
Integrated electronic and photonic components in optical engines face challenges with large connection areas and low packaging flexibility due to pre-formed waveguides on substrates, leading to increased device size and volume.
Innovation Solution
An optical connection element acts as an optical bridge, optically coupling photonic components with a compact integrated waveguide ensemble, allowing for flexible arrangement and reducing connection area occupancy, thereby enhancing packaging flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pre-formed waveguides on substrates are used to connect photonic components, then optical signal transmission is achieved, but the connection area becomes large and packaging flexibility is reduced
Solution Approach 1:
The patent divides the optical connection system into separate modular components: photonic components with pre-formed waveguides and a distinct optical connection element. This segmentation allows each component to be optimized independently and enables compact integration by eliminating the need for large pre-formed waveguide paths on the substrate, thereby reducing the overall connection area while maintaining reliable optical signal transmission.
Solution Approach 2:
The optical connection element acts as an intermediary component between photonic components. Instead of directly connecting components through large pre-formed waveguides on the substrate, the patent introduces this intermediate element that provides efficient optical coupling with a compact footprint, thus reducing the connection area while preserving signal transmission reliability.
2Reliability
If pre-formed waveguides on substrates are used to connect photonic components, then optical signal transmission is achieved, but packaging flexibility is reduced
Solution Approach 1:
The patent introduces dynamic adjustability in the optical connection element, allowing the coupling characteristics to be tuned after fabrication. This enables the same compact connection structure to adapt to different packaging configurations and application requirements, thereby maintaining packaging flexibility while ensuring reliable optical signal transmission through the pre-formed waveguides.
Solution Approach 2:
By segmenting the optical connection into separate modular components with standardized interfaces, the patent enables flexible packaging arrangements. The photonic components with pre-formed waveguides can be connected to the optical connection element in various configurations, allowing adaptation to different device layouts and packaging requirements without compromising signal transmission reliability.
3Reliability
If conventional optical connection methods are used, then optical coupling is achieved, but device size and volume increase
Solution Approach 1:
The patent implements a nested structure where the optical connection element is integrated within or adjacent to the photonic components in a compact arrangement. The pre-formed waveguides are embedded within the substrate structure, and the optical connection element is positioned to couple with these waveguides without requiring additional external space, thereby achieving efficient optical coupling with minimal device volume through nested integration.
Solution Approach 2:
The patent transitions from planar, two-dimensional connection paths to three-dimensional vertical coupling by positioning the optical connection element above or below the substrate plane. This dimensional change allows compact vertical integration of optical connections, reducing the overall device footprint and volume while maintaining efficient optical coupling through the pre-formed waveguides.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the area occupied by connections between optical components, increases packaging flexibility, and maintains efficient optical coupling, addressing the issues of large device areas and volumes in integrated optical engines.
Implementation Method 1
an optical coupling structure between the first photonic component and the second photonic component and configured to optically couple the first waveguide to the second waveguide
Data Source
AI summary
An optical device is provided. The optical device includes a first photonic component; a first electronic component at least partially over the first photonic component; and an optical connection element at least partially over the first photonic component, the optical connection element being separated from the first electronic component.