Optical Connection Assembly Mechanical Features FOWLP
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Solution Overview
Problem
The existing methods for adding mechanical features to electronic and optical packages, such as etching and drilling, are costly, time-consuming, and prone to damaging fragile components, with limited precision and depth capabilities, making them inefficient for producing mechanical features on photonics dies and electronics boards.
Innovation Solution
The implementation of Fan Out Wafer Level Packaging (FOWLP) processes to directly add mechanical components, such as fasteners, onto reconstituted dies without mechanical processing, using epoxy materials and prefabricated holes/slots, which provides structural support and ensures optical connections without damaging fragile components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional etching and drilling methods are used to add mechanical features to electronic and optical packages, then mechanical features can be created, but the process becomes costly, time-consuming, and prone to damaging fragile components
Solution Approach 1:
The patent replaces traditional mechanical etching and drilling processes with a chemical bonding approach using epoxy materials. The epoxy is applied to the backside of the photonic element and cured to form mechanical features such as holes and slots, eliminating the need for mechanical contact with fragile components during feature creation.
Solution Approach 2:
The patent changes the state of the epoxy material from liquid to solid through curing to create mechanical features. By controlling the curing process, the epoxy transforms into a rigid structure that provides mechanical support and forms precise holes and slots without requiring mechanical processing of the fragile photonic element.
2Manufacturing precision
If traditional etching and drilling methods are used, then mechanical features can be created, but the precision and depth capabilities are limited
Solution Approach 1:
The patent replaces mechanical etching and drilling with a chemical bonding and curing process. The epoxy material can be precisely positioned and cured to create features with greater precision and depth control, as the chemical process allows for better material flow and filling capabilities compared to mechanical removal methods.
3Productivity
If Fan Out Wafer Level Packaging (FOWLP) processes are used to directly add mechanical components, then costs are reduced and component damage is minimized, but the process requires epoxy materials and prefabricated holes/slots
Solution Approach 1:
The patent incorporates the creation of mechanical features as part of the packaging process itself rather than as a separate post-processing step. The epoxy is applied and cured during the assembly process to form mechanical features that simultaneously provide structural support and enable fastener attachment, eliminating the need for separate mechanical processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach streamlines the addition of mechanical features, reducing costs and minimizing damage, while enabling precise and deeper mechanical features, thus enhancing the efficiency and reliability of optical and electronic package assembly.
Implementation Method 1
using epoxy materials
Data Source
AI summary
An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.