Optical Connector Resin Composition for Stable PC Contact
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Solution Overview
Problem
Existing resin compositions for optical connection components struggle to balance suppression of connection loss fluctuation due to temperature increase with maintaining satisfactory physical contact (PC) connections, as high inorganic filler content increases rigidity, leading to increased resistance during guide pin insertion and potential deterioration of PC connections.
Innovation Solution
A resin composition with a base resin having a glass transition temperature of 85°C or higher, a residue mass of 68.0% to 74.4% at 700°C, and a Rockwell hardness of 97.1 to 106.8, combined with an inorganic filler having specific particle size and distribution, to ensure both temperature stability and efficient PC connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the content of inorganic filler is increased to suppress connection loss fluctuation due to temperature increase, then temperature stability is improved, but rigidity becomes too high and resistance during guide pin insertion increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the glass transition temperature of the base resin (≥85°C), the residue mass after heating at 700°C (68.0-74.4%), and the Rockwell hardness (97.1-106.8). These parameter adjustments allow optimization of both temperature stability and insertability, resolving the contradiction between suppressing connection loss fluctuation and maintaining ease of guide pin insertion.
Solution Approach 2:
The patent uses composite materials by combining a base resin with specific glass transition temperature properties and inorganic filler in controlled proportions. This composite structure enables simultaneous achievement of temperature stability (through the resin-inorganic filler composite) and appropriate rigidity (through controlled composition ratios), thereby resolving the contradiction between connection loss suppression and insertion resistance.
2Stability of the object's composition
If the content of inorganic filler is increased to suppress connection loss fluctuation due to temperature increase, then temperature stability is improved, but PC connection quality deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the glass transition temperature of the base resin (≥85°C), the residue mass after heating at 700°C (68.0-74.4%), and the Rockwell hardness (97.1-106.8). These parameter adjustments allow optimization of both temperature stability and insertability, resolving the contradiction between suppressing connection loss fluctuation and maintaining ease of guide pin insertion.
Solution Approach 2:
The patent uses composite materials by combining a base resin with specific glass transition temperature properties and inorganic filler in controlled proportions. This composite structure enables simultaneous achievement of temperature stability (through the resin-inorganic filler composite) and appropriate rigidity (through controlled composition ratios), thereby resolving the contradiction between connection loss suppression and insertion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively suppresses connection loss fluctuation at high temperatures while maintaining favorable PC connections, meeting international standards for connection stability in harsh environments.
Implementation Method 1
A glass transition temperature of the base resin is higher than or equal to 85° C.
Implementation Method 2
When the optical connection component deforms due to the temperature increase, the position of the optical fiber end face is shifted
Implementation Method 3
A mass of a residue obtained by heating the resin composition for the optical connection component at 700° C. is greater than or equal to 68.0% and less than or equal to 74.4%
Implementation Method 4
a second step for injection-molding a mixture obtained in the first step
Data Source
AI summary
The present invention intends to provide a resin composition for an optical connection component capable of achieving both suppression of loss fluctuation due to temperature increase and satisfactory PC connection. The resin composition for an optical connection component includes a base resin and an inorganic filler. A glass transition temperature of the base resin is higher than or equal to 85° C. A mass of a residue obtained by heating the resin composition for the optical connection component at 700° C. is greater than or equal to 68.0% and less than or equal to 74.4% with respect to a mass of the resin composition for the optical connection component. A Rockwell hardness of the resin composition for the optical connection component is greater than or equal to 97.1 and less than or equal to 106.8.