Optical Connector Unit for Photonic Integrated Circuits
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Solution Overview
Problem
Current photonic integrated circuits (PICs) face challenges in efficiently channeling laser light between optical fibers and photonic integrated circuits, particularly in transitioning between vertical and horizontal optical paths, which limits their compactness and coupling methodologies.
Innovation Solution
A compact universal photonic engine (COUPE) with an optical connector module and optical deflector integrated into the COUPE die, allowing for vertical-to-horizontal beam path conversion using a mirror reflector and transition edge coupler, enabling flexible and efficient optical coupling between external fibers and waveguides within the COUPE die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional optical coupling methods are used between optical fibers and PICs, then coupling efficiency can be maintained, but spatial light divergence increases and device compactness is reduced
Solution Approach 1:
The optical connector die is integrated directly onto the PIC die, nesting the coupling functionality within the existing device footprint. This eliminates the need for separate external coupling components, thereby reducing spatial light divergence while maintaining coupling efficiency through the integrated mirror reflector and transition edge coupler structures.
Solution Approach 2:
The invention introduces a vertical dimension to the optical path by implementing a mirror reflector that redirects light from a vertical fiber input to a horizontal waveguide path. This dimensional transformation allows compact integration without compromising coupling efficiency, as the light path is folded within the vertical-z plane rather than requiring extended horizontal space.
2Volume of moving object
If vertical-to-horizontal beam path conversion is implemented, then device compactness is improved, but device complexity increases due to additional optical components
Solution Approach 1:
The mirror reflector and transition edge coupler are merged into a single integrated optical connector die that is monolithically formed with the PIC. This consolidation reduces device complexity by eliminating the need for separate discrete optical components and their associated alignment mechanisms, while achieving the vertical-to-horizontal beam path conversion needed for compactness.
Solution Approach 2:
The optical connector die serves multiple functions simultaneously: it provides the vertical-to-horizontal beam conversion, acts as the transition interface between fiber and waveguide, and integrates the coupling optics directly onto the PIC. This multi-functionality reduces the need for separate components, thereby reducing overall device complexity while maintaining compactness.
3Manufacturing precision
If integrated optical connector die is used, then manufacturing precision is improved, but ease of manufacture decreases due to integrated fabrication requirements
Solution Approach 1:
The optical connector components (mirror reflector, transition edge coupler) are merged with the PIC and fabricated using the same monolithic semiconductor processing steps. This integration ensures that all components are manufactured with identical precision tolerances on a single wafer, eliminating the need for post-fabrication alignment and assembly, thereby maintaining high manufacturing precision while simplifying the overall fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances optical coupling efficiency, reduces spatial light divergence, and facilitates compact, versatile optical connector designs, supporting diverse coupling modes and applications in photonic integrated circuits and silicon photonics.
Implementation Method 1
a first connector-side mirror reflector and a first transition edge coupler embedded in a first dielectric matrix layer... configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler
Implementation Method 2
transition edge coupler embedded in a first dielectric matrix layer... configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler
Data Source
AI summary
A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein, and the EIC die including semiconductor devices therein; and an optical connector unit including a first connector-side mirror reflector and a first transition edge coupler, wherein the first connector-side mirror reflector is configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler.