Optical Control Device Groove Ground Electrode Cross-Talk
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Solution Overview
Problem
In optical control devices with multiple modulation electrodes, cross-talk between input-side signal electrodes occurs due to close proximity, leading to signal instability and propagation issues, despite existing methods failing to effectively address this problem between input-side signal electrodes without reducing substrate thickness.
Innovation Solution
The optical control device incorporates a substrate with specific grooves and ground electrodes to reduce the distance between signal electrodes and ground electrodes, terminating electric field lines effectively, and includes thinner parts and through-holes to increase surface area and terminate electric force lines, thereby suppressing cross-talk between input-side signal electrodes without reducing substrate thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the spaced distance between input-side signal electrodes is reduced to increase integration density, then the device can accommodate more modulation electrodes on the substrate, but cross-talk between the input-side signal electrodes increases causing signal propagation instability
Solution Approach 1:
The patent introduces ground electrodes as intermediary elements positioned between the input-side signal electrodes. These ground electrodes act as shields that intercept and redirect electric field lines, preventing direct coupling between adjacent signal electrodes. By placing ground electrodes at strategic positions (including between input-side signal electrodes and along the propagation path), the patent creates an electromagnetic barrier that reduces cross-talk while maintaining compact spacing between signal electrodes, thus preserving integration density while improving signal stability.
Solution Approach 2:
The patent employs three-dimensional electrode structures including grooves etched into the substrate and electrodes positioned at different height levels. By utilizing the vertical dimension (z-axis) with grooves of specific depths and electrodes positioned on substrate surfaces or within groove structures, the patent creates additional separation between adjacent input-side signal electrodes without increasing the planar footprint. This dimensional approach reduces electric field coupling in the vertical direction while maintaining tight horizontal spacing, thereby reducing cross-talk while preserving integration density.
2Object-affected harmful factors
If grooves are formed between operating electrode parts to suppress cross-talk, then the cross-talk between operating electrode parts is reduced, but the substrate thickness must be reduced to 30 μm to 100 μm which complicates manufacturing
Solution Approach 1:
The patent applies grooves selectively in specific regions rather than uniformly across the entire substrate. Grooves are formed primarily in regions where input-side signal electrodes are positioned and where cross-talk is most problematic, while operating electrode parts may have different groove configurations or none at all. This partial application of groove structures allows the patent to achieve cross-talk suppression where needed without uniformly reducing substrate thickness across the entire device, thereby easing manufacturing constraints while maintaining effective cross-talk reduction in critical areas.
3Adaptability or versatility
If the length of input-side signal electrodes is increased to include signal delay circuits or impedance converting circuits, then signal processing functionality is improved, but the propagation stability deteriorates and cross-talk between input-side signal electrodes increases
Solution Approach 1:
The patent introduces ground electrodes as intermediary shielding elements positioned between and alongside the extended input-side signal electrodes that contain signal delay circuits or impedance converting circuits. These ground electrodes create electromagnetic barriers that prevent cross-talk between the longer signal paths, allowing the patent to maintain extended electrode lengths for signal processing functionality while preserving propagation stability through the shielding effect of the ground electrodes.
Solution Approach 2:
The patent utilizes three-dimensional positioning with grooves and ground electrodes at different vertical levels to isolate the extended input-side signal electrodes from each other. By stacking electrode structures at different heights and using grooves to provide vertical separation, the patent allows longer horizontal electrode paths for signal processing while maintaining electromagnetic isolation in the vertical dimension, thereby preserving propagation stability despite increased electrode length and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces cross-talk between input-side signal electrodes, stabilizing signal propagation and maintaining substrate thickness, enhancing the device's performance and reliability.
Implementation Method 1
a first control signal electrode which is provided on the main surface of the substrate so as to change a refractive index of light propagating through the inside of the first optical waveguide on the basis of a first electrical signal
Data Source
AI summary
Provided is an optical control device including first and second optical waveguides, a first control signal electrode including a first input-side signal electrode, a second control signal electrode including a second input-side signal electrode, an inter-signal-electrode ground electrode, a first ground electrode, and a second ground electrode. The substrate has a first groove that is provided between the first input-side signal electrode and the inter-signal-electrode ground, a second groove that is provided between the first input-side signal electrode and the first ground electrode, a third groove that is provided between the second input-side signal electrode and the inter-signal-electrode ground electrode, and a fourth groove that is provided between the second input-side signal electrode and the second ground electrode.