Optical Converter Module With High-Speed Substrate for Long-Reach Signals
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Solution Overview
Problem
Current chip-to-chip transmission methods face limitations in maintaining high signal quality over longer distances due to signal degradation through copper cables and PCB tracks, especially in weight-sensitive applications like aircraft and satellites.
Innovation Solution
An electrical-to-optical converter module that integrates a high-speed substrate with fiber-pigtailed or fiber-connectorized converters, allowing data signals to bypass PCB tracks and directly transition to optical transmission, maintaining high signal quality over extended distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If copper cable connections are used for chip-to-chip transmission, then the connection is simple and direct, but the transmission distance is limited to about 1 meter at 200 Gb/s due to signal degradation
Solution Approach 1:
The patent replaces the electrical copper cable transmission system with an optical transmission system. The electrical signals from the ASIC chip are converted to optical signals that can travel through optical fibers, enabling transmission distances of about 1 km at 200 Gb/s, which is 1000 times farther than copper cable connections while maintaining signal quality.
2Length of stationary object
If pluggable optical modules are used to extend transmission distance, then the reach increases to about 1 km, but the signal quality is degraded due to passage through PCB tracks
Solution Approach 1:
The patent extracts the high-speed data signals from the PCB environment by providing dedicated high-speed substrate traces that bypass the standard PCB routing. This separation allows signals to travel through a controlled high-speed substrate environment rather than degrading through general-purpose PCB tracks, maintaining signal quality over extended distances.
Solution Approach 2:
The patent implements local quality enhancement by providing specialized high-speed substrate routing with controlled impedance and optimized trace geometry specifically for the data signals. This localized high-quality transmission path is provided only where needed for the optical module connection, rather than requiring the entire PCB to be high-speed substrate.
3Ease of manufacture
If FR4 PCB material is used for signal transmission, then the manufacturing is standard and cost-effective, but the signal loss is high at 1.0 to 2.0 dB/inch for 100 Gb/s signals
Solution Approach 1:
The patent applies local quality enhancement by providing dedicated high-speed substrate routing with specialized material properties and trace geometry only where the high-speed data signals need to travel. This localized high-performance routing coexists with standard FR4 PCB material in other areas, maintaining manufacturing simplicity while reducing signal loss in critical paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the reachable distance for high data rate signals, achieving up to 10 meters at 200 Gb/s with multimode VCSELs and potentially 100 times further with single-mode VCSELs or edge emitters, while maintaining signal integrity.
Implementation Method 1
achieving up to 10 meters at 200 Gb/s with multimode VCSELs and potentially 100 times further with single-mode VCSELs or edge emitters
Data Source
AI summary
An electrical to optical converter module has one or more fiber pigtailed or fiber connectorized electrical to optical converters; and a module high speed substrate comprising materials enabling signals at data rates at or above 100 Gb/s to be carried. The module high speed substrate delivers to the electrical to optical converters, for conversion to optical signals, electrical signals received from an output end of a copper cable via an electrical socket connected to the module high speed substrate. An input end of the copper cable is connected to a CPC socket mounted on a source high speed substrate, separate and distinct from the module high speed substrate. The module high speed substrate is connected to a DC socket module mounted on a PCB.