Optical Alignment of Component Conveyors at Chip Transfer Points
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Solution Overview
Problem
Existing component conveying instruments face challenges in precisely aligning conveying instruments for reliable chip transfer, requiring manual adjustments and complex camera systems that increase computing effort and design constraints.
Innovation Solution
A component conveying instrument with an adjustment unit and an imaging unit that captures images of the transfer location to determine an asymmetry measure between the end regions of the conveying instruments, allowing for precise adjustment along adjustment axes to achieve optimal alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual adjustment of turning devices is used to align transducers at transfer location, then alignment precision can be achieved, but adjustment effort and time consumption increase significantly
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated optical measurement and control system. Cameras capture images of transducers at transfer location, processing unit calculates deviations, and actuators automatically adjust positions, eliminating time-consuming manual intervention while maintaining high alignment precision.
Solution Approach 2:
The patent uses optical images (copies) of the transducers and pick-ups to determine alignment deviations. Instead of direct physical measurement, the system captures visual representations and processes them computationally to guide the adjustment process, enabling fast and non-contact measurement.
2Measurement precision
If downwardly directed camera is placed between two transducers to capture images, then transfer location can be imaged, but space requirements restrict design freedom of conveyor device
Solution Approach 1:
The patent positions the camera in a different spatial arrangement, directing it at an angle to capture images of both transducers without placing it in the constrained space between them. This dimensional repositioning resolves the conflict between imaging capability and design flexibility.
3Device complexity
If upwardly directed camera is arranged away from transfer location to capture images, then device complexity is reduced, but achievable alignment accuracy is fundamentally limited
Solution Approach 1:
The patent enables the conveyor device to rotate to specific angular positions during the adjustment process, allowing the camera to capture images of pick-ups at transfer location dynamically. This dynamic positioning enables high-accuracy measurement without requiring the camera to be physically close to the transfer location.
Data Source
AI summary
A component conveying instrument comprising a first and second conveying instrument for conveying a component. The first conveying instrument is arranged to transfer the component to the second conveying instrument at a transfer location. The component conveying instrument further comprises an adjustment unit for adjusting one of the conveying instruments relative to the other conveying instrument along at least one or about at least one adjustment axis and an imaging unit. The imaging unit captures at least one image of the transfer location showing an end region of the first conveying instrument, and an end region of the second conveying instrument. The component conveying instrument also comprises an analyzing unit for analyzing the image, where the analyzing unit is coupled to the adjusting unit and is adapted to determine an asymmetry measure between the end region of the first conveying instrument and the end region of the second conveying instrument.