Optical Cooling Conduit Network for High-Density Server Thermal Management
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Solution Overview
Problem
Current server and High Performance Computing systems face an IO pin bottleneck due to limited communication demands and thermal engineering challenges, particularly in densely packed blades, where air cooling is insufficient and inefficient, necessitating the development of a solution that can enhance both cooling and communication capabilities.
Innovation Solution
A combined optical transmission and cooling fluid conduit network is introduced, where the same conduits used for cooling can also convey optical signals, utilizing optical transmission media within the conduits to connect and communicate between electronic circuit device components, thereby addressing the IO pin bottleneck and thermal challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used for thermal management, then the system structure is simple, but the cooling efficiency is insufficient for high-density packaging
Solution Approach 1:
The patent combines the cooling function and optical signal transmission function into a single conduit structure. The conduit that delivers cooling fluid to electronic components also serves as the transmission medium for optical signals, thereby merging two separate systems (cooling and communication) into one integrated structure, resolving the contradiction between cooling efficiency and system complexity
Solution Approach 2:
The cooling conduit is designed to perform multiple functions: it acts as both a thermal management channel for cooling high-density components and as an optical transmission medium for data communication. This multi-functionality eliminates the need for separate cooling infrastructure, addressing the insufficiency of air cooling while avoiding increased system complexity
2Productivity
If electrical buses are used for communication, then the system structure is simple, but the communication capacity is limited due to IO pin bottleneck
Solution Approach 1:
The patent replaces the electrical bus system with an optical transmission system. By using optical signals transmitted through the cooling conduit instead of electrical signals through traditional buses, the communication capacity is significantly enhanced while overcoming the IO pin bottleneck, and the conduit network serves dual purposes reducing overall complexity
Solution Approach 2:
The conduit network is designed to simultaneously provide thermal management and high-capacity optical communication. This multi-functional design increases communication capacity without requiring additional dedicated communication infrastructure, thereby avoiding increased device complexity
3Productivity
If separate cooling and communication systems are used, then each system can be optimized independently, but the overall device complexity and space requirement increase
Solution Approach 1:
The patent merges the cooling system and communication system into a single integrated conduit network. The same physical conduit that transports cooling fluid also transmits optical signals, thereby reducing the total volume required for both systems compared to having separate independent systems, while maintaining the performance benefits of both functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves communication capacity and thermal management by allowing optical signal transmission through the same conduits used for cooling, enhancing the performance of electronic circuit devices without requiring additional space, thus overcoming the limitations of electrical buses and air cooling.
Implementation Method 1
the network being in thermal communication with a first set of one or more components of the electronic circuit device
Implementation Method 2
convey: a cooling fluid via the at least one cooling conduit
Implementation Method 3
convey: an electromagnetic signal via the optical transmission medium
Implementation Method 4
an electromagnetic signal via the optical transmission medium
Data Source
AI summary
An electronic circuit device, including a combined optical transmission and cooling fluid conduit network. The network includes at least one cooling conduit having an optical transmission medium. The network is configured to convey a cooling fluid via the at least one cooling conduit and to convey an electromagnetic signal via the optical transmission medium. The network is in thermal communication with a first set of one or more components of the electronic circuit device and in signal communication with a second set of one or more components of the electronic circuit device. The first set and second set of components are at least partly overlapping. A method for conveying optical signal in such an electronic circuit device is also provided.