Optical Coupler Thermal Layout for Precise Photonic Temperature Control
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Solution Overview
Problem
Existing semiconductor photonic devices face challenges in achieving precise temperature control of optical couplers, leading to localized overheating and inefficient heat dissipation, which affects the performance and power consumption of high-speed data transmission.
Innovation Solution
The implementation of a thermally-tuning photonic component with a temperature control member separated from the optical coupler by specific distances and a heat transfer member, combined with a thermal preservation layer to minimize heat loss and ensure uniform heating, thereby improving temperature control and reducing power requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a temperature control member is placed close to the optical coupler for efficient heat transfer, then heat dissipation is improved, but localized overheating occurs and temperature control precision deteriorates
Solution Approach 1:
The patent divides the temperature control function into multiple segments: a temperature control member (heater) separated from the optical coupler, and an intermediate heat transfer member (thermal conductor) that bridges them. This segmentation allows the heater to be positioned at an optimal distance to avoid localized overheating while still achieving efficient heat transfer through the thermal conductor with high thermal conductivity material.
Solution Approach 2:
The patent introduces a heat transfer member as an intermediary component between the temperature control member and the optical coupler. This intermediary serves as a thermal bridge that efficiently conducts heat from the control member to the coupler while distributing the heat uniformly, preventing localized overheating and improving temperature control precision.
2Measurement precision
If the temperature control member is separated from the optical coupler to prevent localized overheating, then temperature control precision is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat transfer member acts as a thermal intermediary that bridges the gap between the separated temperature control member and optical coupler. This intermediary is made of high thermal conductivity material to ensure efficient heat transfer while maintaining the beneficial separation distance that prevents localized overheating.
Solution Approach 2:
The patent employs composite material strategy by using high thermal conductivity material for the heat transfer member, potentially combining different materials with complementary properties to optimize both heat transfer efficiency and thermal distribution uniformity.
3Use of energy by moving object
If thermal preservation measures are implemented to reduce heat loss, then power consumption is reduced, but device complexity increases
Solution Approach 1:
The thermal preservation layer uses composite material strategy by selecting materials with specific thermal properties (low thermal conductivity) to minimize heat loss to the substrate. This layer is integrated into the existing device structure, achieving thermal insulation without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature control of optical couplers, preventing overheating and enhancing the transmission performance of semiconductor photonic devices while reducing power consumption.
Implementation Method 1
a heat transfer member in thermal contact with the optical coupler and configured to transfer heat from the temperature control member to the optical coupler
Implementation Method 2
a thermal preservation layer underlying the insulator layer of the first substrate
Data Source
AI summary
A method of manufacturing a semiconductor photonic device includes: providing a first substrate comprising a base layer, an insulator layer overlying the base layer, and a surface layer overlying the insulator layer; forming an optical coupler in the surface layer of the first substrate; forming a temperature control member partially encircling the optical coupler; removing the base layer of the first substrate; and depositing a thermal preservation layer on the insulator layer of the first substrate, wherein the base layer of the first substrate has a first thermal conductivity and the thermal preservation layer has a second thermal conductivity less than the first thermal conductivity.