Optical Coupling Element Manufacturing via Dicing Blade Cutting
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Solution Overview
Problem
Current optical coupling technologies face challenges in achieving high-efficiency interfaces between optical waveguides on a substrate and optical devices with high reflection loss due to inadequate machining performance for inclined surfaces, particularly in minute regions.
Innovation Solution
A method involving a three-dimensional polyhedral light-reflecting member formed from an inorganic solid material, created by cutting a wafer with a dicing blade and separating it to form a mirror surface with high flatness, which is then inserted into a trench perpendicular to the optical waveguide, allowing for accurate alignment and low reflection loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser beam machining is used to form the reflecting surface, then the optical coupling structure can be manufactured, but the machining performance degrades for inclined surfaces and minute regions, resulting in poor flatness and increased reflection loss
Solution Approach 1:
The patent replaces laser beam machining (thermal field) with dicing blade cutting (mechanical field) to form the reflecting surface. The dicing blade with specific point angle (45° or other angles) directly cuts the wafer to create precisely angled reflecting surfaces with superior flatness, eliminating the machining performance degradation inherent in laser beam processing for inclined surfaces and minute regions.
Solution Approach 2:
The patent changes the machining parameter from laser beam (thermal energy) to dicing blade mechanical cutting. By using a dicing blade with a specifically designed point angle, the system achieves precise control over the reflecting surface angle and flatness, directly addressing the poor machining performance of laser beam machining for inclined surfaces.
2Manufacturing precision
If the reflecting surface is formed by laser beam machining, then the optical coupling structure can be created, but the machining performance significantly degrades for minute regions, resulting in inadequate flatness
Solution Approach 1:
The patent replaces laser beam machining with dicing blade cutting to manufacture the reflecting surface. The dicing blade method provides superior ease of manufacture for minute regions, as it can precisely cut small-sized reflecting surfaces without the performance degradation that occurs with laser beam machining at minute scales.
Solution Approach 2:
The patent segments the wafer into multiple smaller optical coupling elements by using the dicing blade to cut along predetermined lines. This segmentation approach allows each element to have a precisely formed reflecting surface with adequate flatness, even for minute regions, by treating each small element as a separate manufacturing unit.
3Manufacturing precision
If a dicing blade with point angle is used to cut the wafer, then three-dimensional polyhedral light-reflecting members with high flatness can be obtained, but additional processing steps are required
Solution Approach 1:
The patent merges the reflecting surface formation and the element separation processes into a single dicing blade cutting operation. By using a dicing blade with a specific point angle, the system simultaneously creates the angled reflecting surfaces and separates the wafer into individual optical coupling elements, thereby reducing the total number of processing steps while maintaining high flatness.
Solution Approach 2:
The dicing blade is designed to perform multiple functions: it both forms the reflecting surface with the required angle and flatness, and simultaneously separates the wafer into individual elements. This multi-functional approach reduces device complexity by eliminating the need for separate reflecting surface formation and element separation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient optical coupling with reduced reflection loss and improved alignment, enhancing the interface between optical waveguides and devices while maintaining high reflection efficiency.
Implementation Method 1
cutting the back surface of the wafer to form substantially angled portions using a dicing blade having a point angle
Implementation Method 2
having a mirror surface corresponding to a surface of the wafer... obliquely intersects the optical axis of the optical waveguide
Data Source
AI summary
An optical coupling structure that interfaces between optical devices mounted on a substrate and optical waveguides formed in the substrate. A manufacturing method includes preparing a wafer formed on an inorganic solid material on a dicing tape and cutting the back surface of the wafer to form substantially angled portions using a dicing blade having a point angle. The dicing tape is stripped from the wafer and the wafer is separated at the valleys between the substantially angled portions to obtain an optical coupling element. The obtained optical coupling element is a three-dimensional polyhedral light-reflecting member having a mirror surface corresponding to a surface of the wafer. The obtained optical coupling element is inserted into a trench that opens, substantially perpendicular to an optical waveguide of an optical transmission substrate, in the main surface of the optical transmission substrate to provide a structure for optical coupling with the outside.