Optical Coupling Thermal Management via Conductive Lid
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Solution Overview
Problem
Optical coupling systems face thermal management challenges due to thermally insulating materials in coupling pathways, hindering cooling of active optical elements like electro-optic transceivers, and the increasing demand for better thermal management with higher channel counts and multicore fiber applications.
Innovation Solution
An optical coupling system design featuring a substrate with a cavity, an electronic die with coupling holes, an optical element die within the cavity, and a thermally conductive lid that covers the electronic die and substrate, along with an optical cable coupler with a narrowed coupling section, enhancing thermal conductivity and cooling capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical coupling pathways use insulating materials to connect active optical elements and optical connectors, then optical coupling is achieved, but thermal conduction is reduced and cooling ability deteriorates
Solution Approach 1:
The optical coupling system is divided into distinct segments: an active optical element segment, an optical connector segment, and a thermal management segment. The insulating material is confined to a specific coupling pathway segment, while separate thermal conduction pathways are established through the substrate and heat sink structures, allowing optical coupling and thermal management to occur in parallel without interference.
Solution Approach 2:
The substrate acts as an intermediary structure that provides both optical coupling pathways (through insulating materials) and thermal conduction pathways (through thermally conductive structures). The heat sink serves as a thermal intermediary, absorbing heat from the active optical elements and dissipating it away from the coupling system, thereby mediating between the heat-generating components and the external environment.
2Reliability
If large optical connectors are used to couple active optical elements, then optical coupling is achieved, but access to cooling elements is hindered
Solution Approach 1:
The design transitions from a planar arrangement where large connectors block access to a three-dimensional configuration. The substrate is formed with cavities that accommodate active optical elements, allowing cooling elements to be positioned underneath or around the elements in the vertical dimension. The thermally conductive lid covers the top surface while thermal pathways extend through the substrate thickness, enabling cooling access without compromising optical coupling.
Solution Approach 2:
The active optical elements are nested within cavities formed in the substrate. The optical connectors are positioned to engage with these nested elements, while cooling pathways are integrated into the substrate structure surrounding the cavities. This nested arrangement allows multiple functions (optical coupling, thermal management, and access) to coexist in a compact configuration.
3Reliability
If insulating materials are used in optical coupling pathways, then optical signal transmission is achieved, but heat dissipation from active elements is reduced
Solution Approach 1:
The coupling system is segmented into optical pathways and thermal pathways. Insulating materials are applied only to the optical coupling surfaces where they prevent heat transfer while allowing optical signals to pass. Separate thermally conductive structures are provided that do not interfere with optical coupling, creating distinct functional zones for optical transmission and heat dissipation.
Solution Approach 2:
Different regions of the coupling system are assigned different thermal properties. The optical coupling interfaces use insulating materials with low thermal conductivity to maintain optical signal integrity. In contrast, the substrate and heat sink regions use materials with high thermal conductivity to maximize heat dissipation. This local differentiation of material properties allows simultaneous optimization of optical transmission and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves thermal cooling characteristics by creating short and broad thermally conductive paths, effectively managing heat loads and maintaining reasonable operating temperatures for optical elements and electronic circuits.
Implementation Method 1
a thermally conductive lid that covers and contacts at least a portion of the electronic die and the substrate
Data Source
AI summary
An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.