Optical Navigation Sensor Cover for Variable Hole Shapes
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Solution Overview
Problem
Conventional optical detection devices require redesign and requalification when the shape of the optical navigation system's hole changes, leading to increased product qualification costs and time due to the inflexibility of the chip package and covering components.
Innovation Solution
An optical detection device with a substrate, housing, optical modulating component, optical sensor, and a replaceable cover that maintains a consistent housing design, allowing the cover to be adapted for various appearance demands without additional product qualification procedures, by aligning with the optical navigation apparatus's light penetrating area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the chip package and covering component are redesigned when the hole shape changes, then the appearance demand is met, but the product qualification procedure must be reimplemented increasing cost and time
Solution Approach 1:
The patent segments the optical detection device into a standard chip package (base, housing, optical emitter, optical sensor) and a separate covering component. The covering component is designed as an independent element that can be attached to the standard chip package without requiring redesign of the entire device. This segmentation allows the covering component to be customized for different hole shapes while the core chip package remains unchanged, eliminating the need for repeated product qualification procedures.
Solution Approach 2:
The patent creates a universal chip package design that can accommodate multiple hole shapes through the use of a standardized housing and base structure. The covering component serves as a universal interface that adapts the standard chip package to different appearance requirements. This universality allows a single chip package design to be used across multiple product variants, reducing qualification time and costs.
2Adaptability or versatility
If the chip package and covering component are redesigned when the hole shape changes, then the appearance demand is met, but the qualification cost increases
Solution Approach 1:
The patent segments the optical detection device into a standard chip package (base, housing, optical emitter, optical sensor) and a separate covering component. The covering component is designed as an independent element that can be attached to the standard chip package without requiring redesign of the entire device. This segmentation allows the covering component to be customized for different hole shapes while the core chip package remains unchanged, eliminating the need for repeated product qualification procedures.
Solution Approach 2:
The patent creates a universal chip package design that can accommodate multiple hole shapes through the use of a standardized housing and base structure. The covering component serves as a universal interface that adapts the standard chip package to different appearance requirements. This universality allows a single chip package design to be used across multiple product variants, reducing qualification time and costs.
3Reliability
If the covering component covers all lateral surfaces of the housing and base, then the structural integrity is maintained, but the device complexity increases when adapting to different appearances
Solution Approach 1:
The patent segments the optical detection device into a standard chip package (base, housing, optical emitter, optical sensor) and a separate covering component. The covering component is designed as an independent element that can be attached to the standard chip package without requiring redesign of the entire device. This segmentation allows the covering component to be customized for different hole shapes while the core chip package remains unchanged, eliminating the need for repeated product qualification procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes the vertical and horizontal dimensions of the optical detection device, allows for batch production without extra qualification, and reduces qualification costs and time by separating the cover or accommodating structure as an independent element that can be assembled without additional product qualification.
Implementation Method 1
an optical emitter disposed inside another chamber and adapted to emit an optical signal toward the first aperture; an optical sensor disposed inside the first chamber and adapted to receive the optical signal
Data Source
AI summary
An optical detection device includes a substrate, a housing, an optical modulating component, an optical sensor and a cover. The housing is disposed on the substrate and includes a first aperture. The housing is unvaried due to inspection standard or design requirement of the optical detection device. The optical modulating component is disposed on the housing and aligning with the first aperture. The optical sensor is disposed on the substrate and adapted to receive an optical signal passing through the optical modulating component and the first aperture. The cover is disposed on the housing to cover the first aperture. The cover is replaceable for attaching the cover varied for the inspection standard or the design requirement to the unvaried housing in response to a surface of the cover opposite to the housing matched and engaged with a light penetrating area on the optical navigation apparatus.


