Optical Crosspoint Switches in Multi-Chip Modules
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Solution Overview
Problem
Current data processing and storage networks face challenges with optical signal routing, as they often require converting optical signals into electrical signals for processing, leading to increased latency and resource consumption, especially in networks with a large number of nodes where physical space and resource management become unmanageable.
Innovation Solution
The implementation of nodes with optical crosspoint switches that allow for the routing of optical signals without conversion to electrical signals, acting as transparent intermediate nodes, thereby reducing latency and resource usage, and utilizing Multi-Chip Modules (MCMs) with silicon interposers for high-density connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical signals are converted to electrical signals for processing in conventional nodes, then data can be routed through intermediate nodes, but latency increases and resource consumption increases
Solution Approach 1:
The patent introduces optical crosspoint switches as intermediary devices that enable direct optical signal routing between nodes without requiring conversion to electrical signals. These optical switches act as mediators that maintain signal integrity while enabling efficient data routing through the network, thereby reducing latency and resource consumption associated with optical-to-electrical conversion.
2Quantity of substance
If more copper traces or lanes are added to PCBA to increase bandwidth, then data transfer capacity increases, but physical space requirements increase and PCBA becomes more complex
Solution Approach 1:
The patent replaces the mechanical/electrical copper trace interconnect system with an optical interconnect system using optical crosspoint switches. This substitution eliminates the need for extensive copper traces and lanes on PCBA, thereby increasing bandwidth capacity without proportionally increasing physical footprint or PCBA complexity.
3Speed
If optical crosspoint switches are implemented for direct optical routing, then latency is reduced and bandwidth is enhanced, but device complexity increases
Solution Approach 1:
The patent segments the network infrastructure into distinct optical crosspoint switch units that can be deployed and managed independently. Each switch handles specific routing functions, allowing the system to achieve high-speed optical routing while managing complexity through modular deployment and standardized interfaces.
4Quantity of substance
If Multi-Chip Modules with silicon interposers are used for high-density connections, then connection density increases and footprint is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functional components (optical crosspoint switches, silicon interposers, and connection interfaces) into integrated Multi-Chip Module assemblies. This consolidation achieves high connection density while managing manufacturing complexity through pre-assembled standardized modules that can be deployed as unified units.
Data Source
AI summary
A Multi-Chip Module (MCM) includes a substrate and a switch controller on the substrate. An optical module on the substrate includes at least one optical crosspoint switch for selectively routing optical signals received by the optical module out of the MCM without the MCM converting the optical signals into electrical signals for processing data from the optical signals by the switch controller. According to another aspect, at least one memory on the substrate is electrically connected to the switch controller by a parallel bus. In another aspect, the MCM includes a plurality of input optical paths for receiving optical signals from outside the MCM, a plurality of output optical paths for transmitting optical signals from the MCM, and a plurality of optical crosspoint switches each connecting an input optical path to an output optical path to selectively route optical signals.