Optical Chip-Scale Package Thermal Dissipation for High Density Switches
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Solution Overview
Problem
High channel density, high data rate data communications systems with optical I/O ports require a compact and efficient thermal management solution to accommodate the heat generated by switch IC chips and optoelectronic components, as traditional solutions necessitate larger housings.
Innovation Solution
The implementation of an optical chip-scale package (CSP) with a single-harness optical subassembly and thermal dissipation system that isolates heat from the switch IC chip and optoelectronic devices, allowing for efficient heat transfer and dissipation within a standard rackmount-sized box, utilizing MPO connectors and a thermal pad with heat blocks for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation solutions (thermal pads, heat spreaders, fans, plenums) are used in high channel density switch boxes, then heat can be dissipated effectively, but the housing size must be enlarged to accommodate all components and thermal management devices
Solution Approach 1:
The patent combines the thermal management function with the existing housing structure by integrating heat dissipation features directly into the housing walls and internal structures. The housing itself becomes part of the thermal management system through integrated heat sinks, thermal vias, and conduction paths, eliminating the need for separate external cooling devices and reducing overall system volume.
Solution Approach 2:
The patent utilizes the housing walls and three-dimensional space more effectively by incorporating thermal management features in the vertical and lateral dimensions. Heat sinks are integrated into housing walls, thermal vias are drilled through housing layers, and cooling channels are formed within housing structures, transforming the housing from a simple enclosure into an active thermal management component.
2Temperature
If optical I/O ports are implemented with robust thermal management, then heat from optoelectronic components can be managed, but the system requires larger housing to accommodate additional thermal management components
Solution Approach 1:
The patent merges thermal management functions directly into the housing structure surrounding optoelectronic components. Heat sinks are integrated into housing walls adjacent to optical ports, thermal vias are embedded in housing layers near component mounts, and the housing material itself serves as a heat conduction path, combining structural enclosure with active cooling without requiring separate cooling subsystems.
3Productivity
If high channel density and high data rate switching is implemented, then data communication performance is improved, but heat generation increases requiring larger thermal management systems
Solution Approach 1:
The patent converts the harmful heat generated by high-performance switching operations into a manageable thermal flow by designing integrated conduction paths that guide heat away from sensitive components through housing structures. The high channel density switching operations that generate heat also validate the effectiveness of the integrated thermal paths, as the same high-performance operations demonstrate the system's capability to handle both data and thermal loads efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the housing of high channel density, high data rate communications systems in a smaller form factor while maintaining robust thermal management, allowing for efficient operation and reduced size requirements, compatible with existing rackmounts.
Implementation Method 1
a thermal pad with heat blocks for effective cooling
Data Source
AI summary
An optical chip-scale package (CSP) is provided for use in a high channel density, high data rate communications system that has optical I/O ports and that is capable of being housed in a standard rackmount-sized box. The optical I/O ports comprise a bulkhead of multi-optical fiber (MF) adapters installed in a front panel of a switch box that houses the communications system. The adapters have first and second receptacles that are adapted to mate with first and second MF connectors, respectively. The communications system comprises a single-harness optical subassembly that uses a plurality of the optical CSPs that interface with a switch IC chip of the communications system to perform electrical-to-optical and optical-to-electrical conversion.