Optical Data Pipe Footprint Reduction via Integrated Packaging
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Solution Overview
Problem
Existing optical interconnect systems have a large footprint, which limits their application space and durability, and require precise alignment, making them less suitable for rugged environments and handling by non-specialized personnel.
Innovation Solution
The use of compact ASIC, chip-on-board, flip-chip, and ruggedized packaging techniques minimizes the footprint of optoelectronic interconnect devices, such as the Optical Data Pipe, allowing for relaxed alignment tolerances and increased durability through direct bonding of transceiver dies to circuit boards and integration of infinite conjugate imagers, reducing the overall size and enhancing handling robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional optical interconnect systems are used, then alignment precision is maintained, but footprint area becomes too large
Solution Approach 1:
The patent merges the emitter array, detector array, and gradient index rod imager into a single integrated optical interconnect system. This consolidation reduces the overall footprint area while maintaining alignment precision through the self-aligning nature of the integrated structure, eliminating the need for separate alignment mechanisms that would increase footprint.
Solution Approach 2:
The patent employs a nested structure where the emitter and detector arrays are positioned at the ends of the gradient index rod imager, with the optical channels nested within the rod imager structure. This nesting approach minimizes the footprint area by utilizing the internal volume of the rod imager for optical transmission rather than requiring external alignment mechanisms.
2Area of stationary object
If optical interconnect systems are made compact, then footprint is reduced, but durability and ruggedness decrease
Solution Approach 1:
The patent implements preliminary alignment and bonding of the emitter and detector arrays to the gradient index rod imager during manufacturing. This pre-alignment ensures that the compact structure maintains its optical alignment and durability under rugged conditions, as the components are permanently bonded in their correct positions rather than requiring field adjustment.
Solution Approach 2:
The gradient index rod imager serves as an intermediary structure that mechanically supports and optically connects the emitter and detector arrays. This intermediary structure provides mechanical protection and structural integrity to the compact configuration, enhancing durability while maintaining the reduced footprint.
3Ease of operation
If alignment tolerances are relaxed for easier handling, then ease of operation improves, but signal transmission quality deteriorates
Solution Approach 1:
The integrated optical interconnect system is designed to be self-aligning through its structural configuration. The emitter and detector arrays are permanently bonded to the gradient index rod imager in fixed positions, creating a self-service system that maintains precise optical alignment without requiring external adjustment mechanisms. This enables relaxed handling requirements while preserving signal transmission quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a low-footprint, high-density, low-power, and low-crosstalk optical interconnect system that is tolerant to handling and displacement, enabling efficient high-bandwidth signal transmission over short and long distances with improved durability and ease of use.
Implementation Method 1
gradient index rod imager
Data Source
AI summary
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.