Optical Deflector Chip Flip-Chip Bonding to Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical deflector apparatuses are large in size due to the need for ceramic packages and wire-bonding, which increases manufacturing costs and reduces yield, especially with wireless wafer-level packaging that requires silicon vias and dicing, leading to defects and increased costs.
Innovation Solution
The optical deflector apparatus uses a flip-chip bonding process with organic or ceramic substrates and metal substrates, eliminating the need for silicon vias and reducing package size by aligning substrate sizes with the optical deflector chip, and incorporating anti-reflection layers in a transparent glass plate for reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a ceramic package with wire-bonding is used, then the optical deflector apparatus can be manufactured, but the package size becomes larger than necessary and manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the ceramic package and wire-bonding structure from the optical deflector apparatus. Instead, it uses a substrate with integrated electrode pads that directly contact the optical deflector electrodes, removing the unnecessary ceramic packaging layer and reducing overall device size while maintaining manufacturability
Solution Approach 2:
The patent merges the substrate and electrode pads into a single integrated structure. The substrate directly provides the electrode pads for electrical connection, combining what were previously separate components (ceramic package and wire bonds) into one unified element, thereby reducing package size and simplifying manufacturing
2Volume of stationary object
If wireless wafer-level packaging with silicon vias is used, then the package size is reduced, but manufacturing yield decreases and cost increases
Solution Approach 1:
The patent removes the silicon via structure from the packaging process. By using a substrate with pre-formed electrode pads that directly contact the optical deflector, it eliminates the need for complex silicon via formation and dicing operations, thereby maintaining small package size while significantly improving manufacturing yield and reducing costs
Solution Approach 2:
The patent employs a simple substrate structure with electrode pads that can be manufactured using standard, cost-effective semiconductor fabrication processes. This replaces the expensive and low-yield silicon via approach with a more economical solution that achieves the same electrical connection function without requiring complex through-silicon via formation and precision dicing
3Volume of stationary object
If the optical deflector size is reduced, then the entire apparatus size decreases, but the developing period increases due to redesign requirements
Solution Approach 1:
The patent changes the packaging approach parameter from ceramic/wire-bonding or silicon via to a simple substrate with electrode pads. This parameter change allows the optical deflector to be reduced in size without requiring fundamental redesign of the packaging structure, thereby reducing apparatus size while avoiding extended development periods associated with redesigning complex packaging systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a compact optical deflector apparatus with reduced manufacturing costs and improved yield by eliminating the need for silicon vias and minimizing defects, while maintaining effective light reflection and transmission.
Implementation Method 1
incorporating anti-reflection layers in a transparent glass plate for reduced manufacturing costs
Implementation Method 2
maintaining effective light reflection and transmission
Data Source
AI summary
In an optical deflector apparatus, an optical deflector chip includes a mirror, an actuator adapted to rock the mirror, and first pads on a front surface of the optical deflector chip and connected to the actuator. A first substrate includes second pads on a back surface of the first substrate, and an opening is formed in the first substrate. The front surface of the optical deflector chip is adhered to the back surface of the first substrate in such a way that the first pads of the optical deflector chip are in contact with respective ones of the second pads of the first substrate and the mirror opposes the opening. A back surface of said optical deflector chip is adhered to a front surface of a second substrate.