Optical Device Glue Layer Bonding for Coupling Loss Reduction
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Solution Overview
Problem
Current devices integrating optical and electrical components for signal conversion and processing face challenges in achieving efficient coupling and reducing coupling losses due to the distance between optical chiplets and laser dies, which affects signal transmission and processing efficiency.
Innovation Solution
The method involves bonding optical chiplets and laser dies with a glue layer of less than 10 μm thickness before attaching them to a substrate, allowing for direct coupling and reducing the need for additional structures, and also bonding optical chiplets to each other and to interposer substrates to minimize coupling losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If optical chiplets and laser dies are bonded with a glue layer, then coupling losses are reduced, but the distance between components increases
Solution Approach 1:
The patent changes the parameter of glue layer thickness to optimize the balance between coupling efficiency and component distance. By controlling the thickness within a specific range (e.g., 1-10 μm), the invention achieves reduced coupling losses while minimizing the increase in distance between optical chiplet and laser die.
2Loss of energy
If additional coupling structures are used, then coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent extracts the coupling function from separate additional structures and integrates it directly into the glue layer itself. The glue layer is formulated with specific optical properties (refractive index, thickness) to provide coupling functionality, eliminating the need for separate coupling structures and reducing device complexity.
Solution Approach 2:
The glue layer serves multiple functions simultaneously: it provides mechanical bonding between components, optical coupling for signal transmission, and potentially electrical isolation. This multi-functionality reduces the need for additional specialized structures, simplifying the overall device design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces coupling losses and enables efficient signal transmission and processing by minimizing the distance between optical and electrical components, facilitating direct coupling without additional structures, thereby enhancing the performance of optical and electrical signal conversion and processing.
Implementation Method 1
bonding optical chiplets and laser dies with a glue layer of less than 10 μm thickness
Data Source
AI summary
Optical devices and methods of manufacture are presented in which an optical device and other devices such as laser dies are attached prior to bonding of the optical device and laser die to other device. The optical device and laser die are separated by no more than about 10 μm.