Optical Device Conductive Pillars for LiDAR Mount Density
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Solution Overview
Problem
Existing optical devices for LiDAR systems, such as those used in automobile and meteorological applications, face challenges with low working efficiency and increased size due to the need for individual wire connections between laser chips or control ICs and soldering contact pads, leading to low mount density and larger outer geometry when surface-mounted.
Innovation Solution
An optical device configuration featuring a substrate with capacitors and optical elements connected via interconnections, with conductive pillars extending from the substrate to connect to a circuit board, eliminating the need for individual wire connections and allowing for higher efficiency and reduced size by enabling flip-chip mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser chip or control IC is placed inside housing and connected through wire one by one, then electrical connection is achieved, but working efficiency is low and working hours are long
Solution Approach 1:
The patent merges the electrical connection process by using conductive pillars that are formed simultaneously with the substrate structure, eliminating the need for separate wire connection steps for each chip. This integration of connection structures into the manufacturing process itself resolves the contradiction between achieving electrical connection and maintaining high productivity.
Solution Approach 2:
The conductive pillars are formed in advance during substrate fabrication before the laser chips or control ICs are mounted. This preliminary preparation of connection structures eliminates the need for time-consuming individual wire connections during assembly, thereby improving working efficiency and reducing working hours.
2Reliability
If laser chip or control IC is placed inside housing, then electrical connection is achieved, but module size increases
Solution Approach 1:
The patent extracts the connection function from the housing structure and implements it directly on the substrate through conductive pillars. This separation allows the housing to be minimized in size while maintaining reliable electrical connections, resolving the contradiction between connection reliability and compact module size.
Solution Approach 2:
The conductive pillars extend vertically from the substrate surface, utilizing the vertical dimension to achieve electrical connections without increasing the horizontal footprint of the module. This dimensional approach allows reliable connections while maintaining compact module size for surface mounting.
3Reliability
If module size is increased for individual connections, then electrical connection is achieved, but mount density is low and outer geometry is large
Solution Approach 1:
The patent combines multiple functions (substrate support, electrical connection, and signal transmission) into the conductive pillars that are integrated with the substrate. This merging eliminates the need for separate connection components that would increase module footprint, thereby improving mount density while maintaining reliable electrical connections.
Data Source
AI summary
An optical device is provided that includes at least one optical element, a substrate where a capacitor is arranged and the optical element is disposed thereon, and an interconnection formed on the substrate, with the capacitor and the optical element being electrically connected to each other through the interconnection. The optical device further includes at least one conductive pillar that is larger in height from the substrate than at least than the optical element and is electrically connected to a part of an interconnection. Moreover, an electrode is formed on a surface of each conductive pillar opposite to a surface thereof connected to the part of the interconnection, with the electrode being electrically connected to a circuit board.