Packaged Optical Device Sealing Resin Integration

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Solution Overview

Problem

Existing optical device manufacturing processes involve multiple steps, leading to increased costs and a higher likelihood of dust contamination and defects, particularly due to the separation of adhesive application and sealing resin filling steps, which complicates process management and requires air hole formation.

Innovation Solution

A compact optical device design featuring a three-dimensional substrate with recessed portions and protruding columns that allows for the integration of light receiving or emitting elements and translucent members with a sealing resin in a single step, reducing the risk of dust contamination and simplifying the manufacturing process by eliminating the need for separate adhesive application and air hole formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive application and sealing resin filling are performed as separate steps, then the sealing reliability is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improvesealing reliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the adhesive application step and sealing resin filling step into a single integrated operation. The adhesive is applied to the entire surface of the stepped portion in one step, and the sealing resin is filled simultaneously without requiring separate processing stages, thereby reducing manufacturing complexity while maintaining sealing reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive serves multiple functions: it acts as both the bonding agent for the stepped portion and as the sealing medium that prevents dust contamination. This multi-functionality eliminates the need for separate adhesive application and sealing resin filling steps, reducing process complexity while ensuring reliable sealing.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple processing steps are used, then the sealing quality is improved, but the productivity decreases

Engineering Contradiction:
Improvesealing qualityVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple processing steps (adhesive application, air hole formation, sealing resin filling) into a single step where adhesive is applied to the entire stepped portion surface and sealing resin is filled simultaneously, eliminating the need for separate operations and improving manufacturing efficiency while maintaining sealing quality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive is applied to the entire surface of the stepped portion in advance, including areas that will be covered by the translucent member. This preliminary action ensures that no additional steps are needed later for adhesive application, and the sealing resin can be filled immediately without waiting for separate processing stages, thereby improving productivity.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If separate adhesive application and sealing resin filling steps are used, then the sealing reliability is improved, but the cost increases

Engineering Contradiction:
Improvesealing reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines adhesive application and sealing resin filling into one step, reducing the number of processing operations required. This integration reduces manufacturing cost by eliminating the need for multiple setup changes, material handling operations, and quality inspection points that would be required in separate processing steps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive performs dual functions as both bonding agent and sealing medium, eliminating the need for separate sealing resin material and associated processing costs. This multi-functionality reduces material costs and processing costs while maintaining sealing reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Manufacturing precision

If multiple processing steps are used, then the sealing quality is improved, but the dust contamination risk increases

Engineering Contradiction:
Improvesealing qualityVSAvoiddust contamination
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent combines adhesive application and sealing resin filling into a single step, minimizing the exposure of the assembly to the environment. By completing both operations in one continuous process without intermediate openings or air holes, the risk of dust contamination is significantly reduced while sealing quality is maintained.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive is applied to the entire stepped portion surface in advance before any opening is created. This preliminary action ensures that the adhesive is already in place and will seal the area when the translucent member is installed, preventing dust contamination during subsequent operations while maintaining sealing quality.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables reliable sealing of elements and translucent members in a single step, reduces the likelihood of defects, and allows for downsizing of optical devices while improving productivity and cost-effectiveness.

Implementation Method 1

the element and the translucent member are integrated with the three-dimensional substrate by a sealing resin filled between the three-dimensional substrate and the element

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10319766B2Packaged optical device with sealing resin and method of manufacturing packaged optical device
Publication Date: 2019.06.11 MICRO MODULE TECH
  • US10319766B2 patent drawing
  • US10319766B2 patent drawing
  • US10319766B2 patent drawing

AI summary

First, a three-dimensional substrate is placed such that the rear surface is oriented upward. Next, a translucent member is placed inside a recessed portion so as to cover a through-hole by bringing a first surface of the translucent member into contact with a protruding portion. Next, an element is placed on the rear surface of the three-dimensional substrate so as to cover the recessed portion. Next, a sealing resin is filled between three-dimensional substrate and the element, between the element and a second surface of the translucent member that opposes the first surface, between a side surface of the translucent member and the three-dimensional substrate, and between the first surface of the translucent member and the three-dimensional substrate. In this way, the element and the translucent member are integrated with the three-dimensional substrate.