Compact Optical Device With Through-Layer Electrical Connectivity
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Solution Overview
Problem
Existing manufacturing techniques for micro-optical devices result in large optical device sizes due to excess material surrounding optical elements, which complicates electrical connectivity and increases costs, while also requiring intricate geometries and complex processes to avoid obstructing optical elements.
Innovation Solution
A compact optical device design featuring a substrate with a first electrically-conductive element patterned on it, where a second electrically-conductive element extends through a layer of material forming an optical element, providing reliable electrical connectivity without obstructing the optical elements and reducing material costs by minimizing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing manufacturing techniques are used to form optical elements, then optical elements can be produced, but excess material surrounds the optical elements resulting in large device sizes
Solution Approach 1:
The patent extracts and removes the excess material (yard) surrounding the optical elements after formation. The layer of material is selectively removed from regions outside the optical elements while preserving the optical elements themselves, thereby reducing device size without affecting optical element quality or formation precision.
2Ease of manufacture
If electrical connections are placed adjacent to the layer of material, then electrical connectivity can be implemented, but the device size increases and reliability decreases due to exposure to moisture and oxidation
Solution Approach 1:
The patent implements the second electrically-conductive element extending through the layer of material, nesting the electrical connection path within the structure of the optical device. This allows the electrical connection to be protected by the surrounding portion of the layer of material, shielding it from moisture and oxidation while maintaining manufacturability.
3Ease of manufacture
If intricate geometries and complex processes are used to place electrical connections, then electrical connectivity can be achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent transitions from placing electrical connections in the lateral plane (adjacent to the layer) to extending them through the vertical dimension (through the layer of material). This dimensional change simplifies the geometry by using a straightforward vertical extension rather than complex lateral routing, reducing device complexity while maintaining electrical connectivity.
Data Source
AI summary
Optical Device and Manufacturing Method An optical device (380) is disclosed, the device comprising a substrate (330), first electrically-conductive element (325) formed as a pattern on the substrate, a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370), and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element. Also disclosed is an associated method of manufacturing the optical device (380), and an apparatus (600) comprising at least one of the disclosed optical devices, a camera (605), and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.