Optical Communication Device Vertical Stacking Through Vias
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Solution Overview
Problem
High-speed data transmission between processors using electrical signals faces challenges such as RC signal delay, impedance mismatching, EMC/EMI, and crosstalk, limiting further increases in data transmission speed, and existing optical communication technologies require improved reliability in electrical signal quality between processors and drive circuits.
Innovation Solution
An optical communication device with a drive circuit substrate and a signal processing substrate stacked vertically, using through vias to connect optical elements directly, and incorporating a thin film capacitor for improved signal processing, reducing wiring length and noise, and enhancing signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical signals are used for data transmission between processors, then data transmission can be achieved, but RC signal delay, impedance mismatching, EMC/EMI, and crosstalk occur which limit further increases in data transmission speed
Solution Approach 1:
The patent replaces electrical signal transmission through copper wiring with optical signal transmission through optical waveguides. This substitution eliminates the RC signal delay, impedance mismatching, EMC/EMI, and crosstalk problems inherent in electrical transmission, enabling higher data transmission speeds while maintaining signal quality.
Solution Approach 2:
The patent introduces optical waveguides as intermediary components to transmit data between processors. The waveguides serve as a mediator that converts electrical signals to optical signals for transmission, avoiding the limitations of direct electrical connection while enabling high-speed data transfer.
2Speed
If optical communication technology is used to transmit data using light, then higher data transmission speed can be achieved, but electrical signals are still required between optical devices and processors which necessitates improved reliability
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical stacking with through-vias. By moving connections to the vertical dimension through the substrate thickness, the patent minimizes the horizontal wiring length between optical devices and processors, reducing signal degradation and improving electrical signal quality while maintaining high-speed optical transmission.
3Reliability
If through vias are used to connect optical elements directly, then wiring length is reduced and signal degradation is minimized, but device complexity increases
Solution Approach 1:
The patent segments the substrate into multiple functional layers: a first substrate carrying optical elements, a second substrate carrying processor circuits, and through-vias connecting them. This segmentation allows each layer to be optimized independently while the through-vias provide direct vertical connections, reducing overall wiring length and signal degradation despite increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves higher reliability and faster data transmission by minimizing signal degradation and noise, enabling more efficient optical communication between processors.
Implementation Method 1
incorporating a thin film capacitor for improved signal processing
Implementation Method 2
the optical communication technology that modulates electrical signals into optical data and transmits data using light
Data Source
AI summary
An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.