Optical Element Driving Mechanism Circuit Unit Thickness Reduction
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Solution Overview
Problem
The miniaturization of electronic devices with camera or video functions is hindered by the thickness of the lens driving module, which is a critical component for autofocus and optical image stabilization, necessitating a reduction in the thickness of this module.
Innovation Solution
The optical element driving mechanism incorporates a circuit unit with a plate-connecting portion and a layer-connecting portion of different thicknesses, where the plate-connecting portion is partially embedded in the base, and the layer-connecting portion is disposed on the base, allowing for a thinner design while maintaining electrical connectivity and mechanical strength through the use of conductive materials and magnetic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional circuit unit design is used, then electrical connectivity is maintained, but the thickness of the lens driving module increases
Solution Approach 1:
The circuit unit transitions from a conventional planar design to a three-dimensional structure with a plate-connecting portion extending in the thickness direction. This dimensional change allows electrical connections to be established through vertical stacking rather than lateral routing, reducing the overall thickness of the lens driving module while maintaining reliable electrical connectivity between components.
Solution Approach 2:
The plate-connecting portion is partially embedded within the base structure, creating a nested configuration where the circuit unit integrates into the existing module architecture. This nesting approach allows electrical connections to be formed within the available space without increasing the external dimensions of the lens driving module.
2Length of moving object
If the circuit unit is thinned, then miniaturization is achieved, but mechanical strength is reduced
Solution Approach 1:
The circuit unit employs a composite structure combining a plate-connecting portion made of conductive material with a base structure. This composite design provides both electrical conductivity and mechanical strength, allowing the circuit unit to be thinned while maintaining sufficient structural integrity through the synergistic combination of materials with different properties.
Solution Approach 2:
The circuit unit is segmented into distinct functional portions: the plate-connecting portion for electrical connectivity and the base for mechanical support. This segmentation allows each portion to be optimized independently - the plate-connecting portion can be thin for miniaturization while the base provides the necessary mechanical strength.
3Length of moving object
If the plate-connecting portion is embedded in the base, then thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The plate-connecting portion and base are combined into a single integrated circuit unit structure. This merging eliminates the need for separate assembly steps to attach distinct electrical connection components, as the plate-connecting portion is formed as an integral part of the base structure, thereby reducing manufacturing complexity despite the three-dimensional configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the overall thickness of the optical element driving mechanism, enhancing miniaturization, mechanical reliability, and thermal dissipation, while maintaining the functionality for autofocus and optical image stabilization.
Implementation Method 1
The driving assembly further includes a magnetic element, and the magnetic element overlaps the plate-connecting portion
Data Source
AI summary
An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly, and a circuit unit. The movable portion is movably connected to the fixed portion, and holds an optical element. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit unit includes a base, a plate-connecting portion, and a layer-connecting portion. The plate-connecting portion is partially embedded in the base. The layer-connecting portion is disposed on the base. The driving assembly is electrically connected to the layer-connecting portion. The thickness of the plate-connecting portion is different from the thickness of the layer-connecting portion.