Optical-Element Driving Device Fixing Part Heat Management
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Solution Overview
Problem
Conventional optical-element driving devices face challenges in achieving both miniaturization and mass productivity due to structural issues related to heat exposure affecting the fixing part during the connection of wire members and electrical components, leading to potential deformation and reduced productivity.
Innovation Solution
The optical-element driving device incorporates a supporting part with aligned wire members connected to an electrical component, featuring a recessed portion with indented and protruding sidewalls to bypass wire members, allowing for secure connection while minimizing heat impact and maintaining device compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electrical component is embedded in the fixing part with exposed connecting part, then miniaturization is achieved, but the fixing part is deformed by heat during wire connection
Solution Approach 1:
The fixing part is segmented into distinct functional zones: a heat-resistant supporting part that bears thermal load during wire connection, and an electrical component mounting area that remains thermally isolated. This segmentation allows the supporting part to absorb heat without transmitting it to the electrical component, preventing deformation while maintaining compact device size.
Solution Approach 2:
The supporting part acts as a thermal intermediary between the wire connection area and the electrical component. It provides a heat-resistant pathway for wire attachment while blocking heat transmission to the electrical component, thus protecting sensitive electronics from thermal damage during the connection process.
2Ease of manufacture
If the fixing part is exposed to heat during wire connection, then connection is achieved, but productivity is reduced due to deformation
Solution Approach 1:
The fixing part is segmented into distinct functional zones: a heat-resistant supporting part that bears thermal load during wire connection, and an electrical component mounting area that remains thermally isolated. This segmentation allows the supporting part to absorb heat without transmitting it to the electrical component, preventing deformation while maintaining compact device size.
Solution Approach 2:
The supporting part is designed to intentionally absorb and withstand the heat generated during wire connection, converting a potentially harmful thermal effect into a beneficial protective function. By being strategically positioned and made heat-resistant, the supporting part shields the electrical component from thermal damage, enabling reliable connection without compromising productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables both miniaturization and mass productivity of the optical-element driving device, camera module, and camera-mounted device by preventing undesired deformation and ensuring reliable connections, thus enhancing their performance and manufacturing efficiency.
Implementation Method 1
heat applied to the connecting part during a connecting operation between a wire component and the electrical component
Data Source
AI summary
An optical-element driving device includes at least one set of wire members aligned with each other, configured to couple the fixing part to the housing, and connected to an electrical component of the fixing part. The fixing part includes a recessed portion that is recessed in an upper-lower direction, and a sidewall of the recessed portion includes a first portion and a second portion in a direction in which the wire members are aligned with each other, the first portion located at a position corresponding to each wire member, the second portion located between adjacent ones of the first portions, and the sidewall is shaped to be indented at the first portions to bypass corresponding wire members, and to protrude at the second portion toward a gap between the adjacent wire members.