Optical-Electrical Converter Memory Chip Package
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Solution Overview
Problem
The electronics industry faces challenges in reducing the size and cost of electronic products while increasing their speed and performance, particularly in scaling down and integrating semiconductor devices, which requires innovative approaches to interconnect and communicate multiple semiconductor chips effectively.
Innovation Solution
A memory chip package is developed with a stack of memory chips optically and electrically connected through a through-via, allowing optical signals of different wavelengths to be transmitted and converted by each chip, enabling independent or simultaneous communication with external devices using wavelength division multiplexing and optical-electrical converters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are integrated in a single package to increase performance, then processing power and data handling capability are improved, but device complexity and interconnection challenges increase
Solution Approach 1:
The patent divides the interconnection system into separate optical and electrical pathways. Optical pathways handle high-bandwidth data transfer between chips, while electrical pathways handle control signals and lower-bandwidth communication. This segmentation allows each pathway to be optimized independently, reducing overall system complexity while maintaining high productivity.
Solution Approach 2:
The patent introduces optical converters as intermediary devices that translate between optical signals (used for high-speed data transfer) and electrical signals (used for control and traditional communication). These converters act as mediators that enable seamless integration of optical interconnects into existing electrical chip architectures, reducing the complexity of direct optical-to-chip integration.
2Speed
If optical interconnects are used to increase data transfer speed, then bandwidth and speed are improved, but integration difficulty and manufacturing complexity increase
Solution Approach 1:
The patent designs optical converters that can operate in multiple modes: receiving optical signals from other chips, converting them to electrical signals for processing, and generating optical signals for transmission. This multi-functionality allows a single component type to handle various communication scenarios, simplifying the manufacturing and integration process compared to requiring specialized components for each function.
Solution Approach 2:
The patent uses standardized optical converter designs that can be replicated across multiple chips in the package. By creating a modular, copyable unit that handles optical-electrical conversion, the system avoids the need for custom-designed optical interfaces on each chip, significantly reducing manufacturing complexity while maintaining high data transfer speeds.
3Volume of moving object
If chip size is reduced to decrease package size, then miniaturization and portability are improved, but heat density and signal integrity challenges worsen
Solution Approach 1:
The patent replaces traditional electrical interconnects with optical interconnects for high-bandwidth data transfer. Optical signals do not generate electromagnetic interference and produce less heat compared to high-speed electrical signals, thereby reducing heat density in the compact package while maintaining miniaturization benefits.
4Productivity
If more chips are stacked to increase integration density, then productivity and performance are improved, but heat dissipation and signal interference challenges increase
Solution Approach 1:
The patent substitutes optical interconnects for electrical interconnects in the vertical stacking architecture. Optical signals are immune to electromagnetic interference, which is a major concern in densely stacked chip configurations. This substitution eliminates signal interference issues while enabling higher integration density through multiple stacked chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances interconnection bandwidth and data transfer speeds, allowing for high-performance operations in a compact form factor, addressing the need for faster and more integrated semiconductor devices.
Implementation Method 1
Each of the memory chips has an optical-electrical converter which is operative to convert optical and electrical signals input thereto to corresponding electrical and optical signals, respectively
Implementation Method 2
The stack of the memory chips has a through-via extending therethrough, and the through-via constitutes an optical path extending to and from each of the memory chips and the outside of the stack and along which the optical signal can propagate
Data Source
AI summary
A memory chip package includes memory chips stacked, electrically connected one another, and configured to input and output an optical signal through an optical line formed by a via penetrating the memory chips. The memory chips input and output optical signals with different wavelengths, and each of the memory chips has an optical-electrical converter configured to convert an optical signal with a corresponding wavelength into an electrical signal and to convert an electrical signal into an optical signal with the corresponding wavelength.