Optical Electron Beam Alignment via Pixelated Locator
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Solution Overview
Problem
The initial alignment of optical and electron beams in charged-particle beam microscopes is challenging, and existing methods for beam alignment and focusing are inefficient, particularly in Correlative Electron and Light Microscopy (CLEM) and semiconductor manufacturing, where impurities in chemical vapor deposition (CVD) deposits hinder reliable circuit testing.
Innovation Solution
A two-dimensional pixelated beam locator (PBL) integrated into the charged-particle beam microscope, utilizing a CCD or CMOS imaging array, is used to align and focus optical and charged-particle beams by detecting beam interactions and adjusting beam positions and focus through a nanomanipulator system, enabling automated alignment and simultaneous detection of both beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual alignment methods are used for optical and electron beams, then the alignment process is simple in setup, but the alignment precision and time consumption are problematic
Solution Approach 1:
A fluorescent coating is applied to the sample surface to serve as an intermediary that converts electron beam interaction into visible optical signal. The fluorescent coating emits light when struck by electrons, creating a visual marker that can be simultaneously detected by both electron and optical beam systems, enabling precise alignment without manual adjustment.
Solution Approach 2:
The system uses the fluorescent emission signal as feedback to automatically adjust beam alignment. The optical beam is configured to detect the fluorescent signal, and this detection provides real-time feedback information about beam position and focus, enabling automated alignment and focusing procedures.
2Adaptability or versatility
If CVD deposits are used for circuit editing, then design edits can be made, but the deposited material contains insulating impurities that prevent reliable circuit testing
Solution Approach 1:
The system changes the physical parameters of the CVD deposit by applying focused optical beam heating. This thermal energy modifies the material properties of the deposited layer, reducing impurity content and improving electrical conductivity, thereby enabling reliable circuit testing after design edits.
Solution Approach 2:
The focused optical beam induces localized phase transitions in the CVD deposit material through heating. This thermal processing transforms the material structure, reducing insulating impurities and improving the electrical properties of the conductive traces for reliable testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise, automated alignment and focusing of optical and charged-particle beams, improving the efficiency of CLEM applications and semiconductor design edits by ensuring accurate beam overlap and maximizing optical irradiance, thereby enhancing the reliability of circuit testing and processing.
Implementation Method 1
A two-dimensional pixelated beam locator (PBL) integrated into the charged-particle beam microscope, utilizing a CCD or CMOS imaging array, is used to align and focus optical and charged-particle beams by detecting beam interactions
Implementation Method 2
adjusting beam positions and focus through a nanomanipulator system
Data Source
AI summary
Apparatus and methods for the alignment of a charged-particle beam with an optical beam within a charged-particle beam microscope, and to the focusing of the optical beam are disclosed. An embodiment includes a charged-particle beam microscope having one or more charged-particle beams, such as an electron beam, and one or more optical beams provided by an optical-beam accessory that is mounted in or on the charged-particle beam microscope. This accessory is integrated into a nanomanipulator system, allowing its focus location to be moved within the microscope. The apparatus includes a two-dimensional pixelated beam locator such as a CCD or CMOS imaging array sensor. The image formed by this sensor can then be used to manually, or automatically in an open or closed loop configuration, adjust the positioning of one or more charged-particle beams or optical beams to achieve coincidence of such beams or focus of one or more such beams.