Optical Element Bonding with Low Tg Resin to Reduce Warpage

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Solution Overview

Problem

The warpage of optical elements composed of glass substrates and resin lenses due to thermal expansion differences leads to degraded optical characteristics, particularly when the resin is on one side of the glass or when the glass is thin and the resin is thick, causing peeling issues with integrated optical filters.

Innovation Solution

An optical element with a glass substrate, an optical function portion made of resin, and a bonding portion with a glass transition point of 85° C. or lower and a Young's modulus of less than 100 MPa to reduce warpage caused by temperature changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a laminate of glass substrate and resin lens is manufactured, then the optical element can be formed, but warpage occurs due to thermal expansion difference between glass and resin

Engineering Contradiction:
Improveoptical element formationVSAvoidwarpage
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

A bonding portion made of resin material is introduced as an intermediary layer between the glass substrate and the optical function portion. This bonding portion acts as a stress buffer that absorbs thermal expansion differences between the glass substrate and the resin lens, preventing warpage while maintaining the structural integrity of the optical element.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent controls the thickness of the bonding portion as a critical parameter to manage warpage. By optimizing the bonding portion thickness to be within a specific range (0.1-1.0 times the glass substrate thickness), the thermal stress is effectively distributed, preventing both warpage and peeling issues.

Inventive Principle:
Principle #35Parameter changes

2Volume of moving object

If the resin is present only on one side of the glass substrate, then the optical system can be compactified, but warpage becomes conspicuous

Engineering Contradiction:
Improveoptical system sizeVSAvoidwarpage
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The bonding portion serves as a stress buffer that compensates for the asymmetric structure. Even though the resin optical function portion is only on one side, the bonding portion on both sides of the glass substrate balances the thermal stress distribution, preventing warpage in the compactified optical system.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If the glass substrate is thin and the resin is thick, then the optical element can be made compact, but warpage is especially conspicuous

Engineering Contradiction:
Improveoptical element sizeVSAvoidwarpage
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The patent establishes specific parameter relationships to control warpage in compact optical elements. The bonding portion thickness is set within a specific range (0.1-1.0 times the glass substrate thickness), and the glass substrate thickness is controlled (0.2-1.0 mm), creating an optimal parameter combination that prevents warpage even when the resin portion is thick.

Inventive Principle:
Principle #35Parameter changes

4Manufacturing precision

If the optical filter is pasted all over the surface of the lens, then the lens and optical filter can be stacked, but the optical filter peels off due to volume expansion difference

Engineering Contradiction:
Improvestacking of lens and optical filterVSAvoidpeeling resistance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

Instead of uniformly pasting the optical filter across the entire lens surface, the patent applies the optical filter only to the optical effective region. The bonding portion extends beyond this region to provide additional bonding area, creating a local quality differentiation that ensures both stacking functionality and peeling resistance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively minimizes warpage and peeling issues, maintaining optical integrity by adjusting the bonding properties to match the thermal expansion coefficients of the glass and resin, ensuring reduced aberrations and improved imaging quality.

Implementation Method 1

the bonding portion has a glass transition point of 85° C. or lower

Methodology Applied
Scientific EffectGlass transition:

Implementation Method 2

warpage occurs in accordance with a change in temperature due to a difference between the linear thermal expansion coefficient of the glass and the linear thermal expansion coefficient of the resin

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

the bonding portion has a Young's modulus of less than 100 MPa

Methodology Applied
Scientific EffectYoung's modulus:

Data Source

PatentUS11740426B2Optical element, optical system and optical device
Publication Date: 2023.08.29 AGC INC
  • US11740426B2 patent drawing
  • US11740426B2 patent drawing
  • US11740426B2 patent drawing

AI summary

An optical element includes: a glass substrate; an optical function portion made of a resin; and a bonding portion that bonds the glass substrate and the optical function portion to each other. The bonding portion has a glass transition point of 85° C. or lower. The glass transition point of the bonding portion may be 50° C. or lower.