Optical Element Shielding via Conductive Coatings
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Solution Overview
Problem
The increasing size of optical elements in mobile devices for higher resolution and range cameras/TOF sensors leads to weaker electrical shielding, making them more susceptible to ESD and EMI, while miniaturization increases the risk of ESD vulnerability and EMI due to closer proximity to other electronic components.
Innovation Solution
A semi-transparent electrically conductive layer and ferrite coating layers are applied on the surface of optical elements outside the metallic shielding enclosure, and electrically conductive coating layers are applied on the inner surface of the enclosure to form a complete shielding structure, which includes electrically conductive and ferrite layers interleaved with each other, connected to the metallic shielding enclosure to absorb or attenuate external electrical aggression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the optical aperture size is increased to improve camera resolution and range, then the imaging performance is improved, but the electrical shielding effectiveness deteriorates
Solution Approach 1:
The patent applies a composite coating structure consisting of multiple layers including transparent conductive oxide layers, ferrite layers, and protective layers. This composite structure combines the optical transparency of TCO with the electromagnetic shielding properties of ferrite, creating a multi-functional coating that maintains both imaging performance and electrical shielding effectiveness despite larger optical aperture sizes
Solution Approach 2:
The patent modifies the optical and electromagnetic parameters of the lens surface by applying coatings with specific optical transmission characteristics and electromagnetic shielding properties. The coating structure is designed to maintain high optical transmission while providing EMI/ESD shielding, effectively changing the surface parameters of the optical element to resolve the contradiction between aperture size and shielding effectiveness
2Measurement precision
If the optical element size is increased to improve imaging range, then the detection capability is improved, but the susceptibility to EMI and ESD increases
Solution Approach 1:
The patent uses thin film coatings applied to the optical element surface to provide EMI and ESD protection. The coating structure includes multiple thin layers of transparent conductive oxide, ferrite, and protective materials that collectively provide electromagnetic shielding without adding significant bulk, thus maintaining imaging range while improving reliability
Solution Approach 2:
The coating structure acts as an intermediary layer between the optical element and the external electromagnetic environment. It mediates the interaction by allowing optical transmission while blocking electromagnetic interference, protecting the imaging sensor from EMI and ESD without compromising the imaging function
3Volume of moving object
If the mobile device is miniaturized to improve portability, then the device size is reduced, but the ESD vulnerability and EMI risk increase due to closer proximity to electronic components
Solution Approach 1:
The patent applies electromagnetic shielding coatings specifically to the optical elements and surrounding areas where EMI and ESD exposure is most critical. By localizing the shielding protection to these vulnerable areas rather than shielding the entire device, the solution addresses miniaturization constraints while providing targeted protection against electrical aggression from nearby electronic components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective shielding against ESD and EMI, ensuring the performance of imaging devices by absorbing or attenuating external electrical signals without significant photon loss, and reduces cavity resonance and RF emissions, while maintaining optical transparency and broadband EMI shielding.
Implementation Method 1
A semi-transparent electrically conductive layer and ferrite coating layers are applied on the surface of optical elements outside the metallic shielding enclosure... to absorb or attenuate external electrical aggression
Implementation Method 2
an electrically conductive coating layer applied on a surface of the optical element that is outside the metallic shielding enclosure, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure
Implementation Method 3
a transparent electrically conductive layer... that is outside the metallic shielding enclosure
Implementation Method 4
maintaining optical transparency... without significant photon loss
Implementation Method 5
semi-transparent ferrite coating layers... electrically conductive coating layers and ferrite coating layers, wherein the electrically conductive coating layers and the ferrite coating layers are interleaved with each other
Implementation Method 6
at least one anti-reflective coating layer... to maintain optical transparency... without significant photon loss
Data Source
AI summary
Embodiments are disclosed for shielding of an optical element of an imaging device in a mobile device. In an embodiment, an imaging device includes: an optical element; a metallic shielding enclosure, wherein the optical element is partially located within the metallic shielding enclosure; an electrically conductive coating layer applied on a surface of the optical element that is outside the metallic shielding enclosure, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure.