Optical Element Cooling Body Separation for EUV Lithography
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Solution Overview
Problem
Optical elements in EUV illumination systems for semiconductor lithography experience undesired deformations due to asymmetric local heat distributions, which can lead to imaging performance issues and mechanical instability, especially during thermal loading.
Innovation Solution
The optical assembly separates the mounting body and cooling body with a heat-conducting element, allowing for efficient heat dissipation through a heat pipe or other heat-conducting materials, minimizing deformation and enabling adaptive cooling for maintaining imaging performance and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the optical element is cooled to dissipate heat, then thermal deformations are reduced, but the structural complexity increases due to integration of cooling channels or mounting
Solution Approach 1:
The mounting body and cooling body are merged into a single integrated component that simultaneously provides mechanical support and thermal management functions. The mounting body includes integrated cooling channels formed within its structure, eliminating the need for separate cooling components and reducing overall structural complexity while effectively dissipating heat from the optical element.
Solution Approach 2:
The mounting body is designed to perform multiple functions: it mechanically supports and positions the optical element while simultaneously serving as a heat sink with integrated cooling channels. This multi-functional design reduces the number of separate components needed and simplifies the overall structure while maintaining effective thermal management.
2Device complexity
If the optical element is uncooled, then the device complexity is reduced, but temperatures of 200°C and above occur during operation
Solution Approach 1:
The mounting body and cooling body are merged into a single integrated component that simultaneously provides mechanical support and thermal management functions. The mounting body includes integrated cooling channels formed within its structure, eliminating the need for separate cooling components and reducing overall structural complexity while effectively dissipating heat from the optical element.
3Device complexity
If the mounting body and cooling body are integrated, then the device complexity is reduced, but the ease of maintenance and adaptation worsens
Solution Approach 1:
The integrated mounting body is designed with modular cooling channels that can be independently accessed and maintained. The optical element can be removed and replaced without dismantling the entire cooling structure, as the cooling channels are integrated into the mounting body rather than requiring separate cooling components. This segmentation approach allows for easy maintenance and adaptation while maintaining the benefits of integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat away from the optical elements, reducing thermal deformations and ensuring stable operation and imaging performance, even under varying thermal conditions, while allowing for easy maintenance and adaptation of the cooling system.
Implementation Method 1
The optical element is connected to the cooling body via at least one heat-conducting element
Implementation Method 2
at least one cooling body for dissipating heat from the optical element
Data Source
AI summary
The disclosure relates to an optical assembly for a projection exposure apparatus for semiconductor lithography. The optical assembly includes at least one optical element and a mounting body for mechanically fixing the element in a supporting structure. The optical assembly also includes at least one cooling body for dissipating heat from the element. The mounting body and the cooling body are separate from one another. The optical element is connected to the cooling body via at least one heat-conducting element. The disclosure also relates to a projection exposure apparatus including an optical assembly according to the disclosure.