Optical Element Groove Segmentation Resist Crack Prevention
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Solution Overview
Problem
The existing methods for forming optical functional portions on substrates often result in resist layer cracking and structural collapse during dielectric deposition, preventing the formation of desired optical elements.
Innovation Solution
A method involving the formation of a groove around the pattern region in the resist layer, followed by dielectric deposition and subsequent removal of the resist layer, which suppresses crack generation and allows for the creation of optical functional portions with desired structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a resist layer is formed on the substrate and dielectric is deposited in the pattern region, then the optical functional portion can be formed with desired structure, but the resist layer cracks and the pattern region structure collapses
Solution Approach 1:
The resist layer is divided into multiple separate regions: a pattern region containing the optical pattern and isolated island regions surrounding it. These island regions are separated from the pattern region by grooves, creating segmentation that prevents crack propagation from affecting the pattern region while maintaining the overall resist layer structure during dielectric deposition
Solution Approach 2:
The island regions of the resist layer serve as intermediary elements between the pattern region and the substrate. These island regions absorb mechanical stress and prevent crack propagation to the pattern region, acting as a buffer zone that protects the critical optical pattern during the dielectric deposition process
2Ease of manufacture
If the resist layer is removed after dielectric deposition, then the optical functional portion is formed, but crack propagation causes collapse of the pattern region structure
Solution Approach 1:
The grooves are formed in the resist layer before dielectric deposition to create isolated island regions. This preliminary segmentation prevents crack propagation paths from developing, ensuring that when the resist layer is later removed, the pattern region maintains its structural integrity and the optical functional portion is formed without collapse
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents crack formation in the pattern region, enabling the production of optical elements with desired structures, improving yield and throughput by ensuring the optical functional portions are formed correctly.
Implementation Method 1
a dielectric is deposited in a state where the resist layer is provided on the main surface, to form the dielectric layer
Data Source
AI summary
A method for producing an optical element includes: forming a resist layer on a main surface of a substrate; forming a pattern region in the resist layer; forming a groove; forming a dielectric layer covering the pattern region; and forming an optical functional portion. The pattern region is formed in the resist layer. The groove is formed in a portion corresponding to a periphery of the pattern region as viewed in a direction orthogonal to the main surface. A dielectric is deposited to form the dielectric layer. After the dielectric layer covering the pattern region is formed, the resist layer is removed to form the optical functional portion at a position where the pattern region is disposed on the main surface. The optical functional portion is made of the dielectric.