Optical Element Module Thermal Management via Layered Temperature-Adjusting Unit
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Solution Overview
Problem
Conventional optical element modules with semiconductor laser elements face challenges in down-sizing and effective temperature control due to component thickness and floating structures, leading to issues with power consumption and characteristic control.
Innovation Solution
The optical element module incorporates a casing with a temperature-adjusting unit having a projecting upper layer portion relative to the lower layer portion, a support member, and a semiconductor laser element, utilizing materials like copper-tungsten and aluminum nitride for thermal management, which alleviates stress from the warp of the bottom plate and maintains desirable semiconductor laser element characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the semiconductor laser element is mounted directly on the bottom plate, then the structure is simple, but temperature control is ineffective and power consumption increases
Solution Approach 1:
The temperature-adjusting unit is divided into a lower layer portion and an upper layer portion positioned at different locations. The lower layer portion is mounted on the bottom plate while the upper layer portion projects toward the rear side of the semiconductor laser element, creating a segmented structure that improves temperature control efficiency without excessive complexity
Solution Approach 2:
The temperature-adjusting unit extends in the vertical dimension with the upper layer portion projecting toward the semiconductor laser element. This three-dimensional configuration allows more effective thermal contact and temperature control compared to a simple planar mounting, reducing the power needed for temperature adjustment
2Volume of moving object
If the casing bottom plate is thin for down-sizing, then the module size is reduced, but the bottom plate warps under temperature changes affecting the laser element
Solution Approach 1:
The lower layer portion of the temperature-adjusting unit serves as an intermediary between the bottom plate and the semiconductor laser element. It provides mechanical support and thermal management that compensates for the bottom plate's warping, allowing the use of thinner plates for down-sizing while maintaining stability
Solution Approach 2:
The temperature-adjusting unit actively controls the thermal parameters of the semiconductor laser element, compensating for dimensional changes and warping of the thin bottom plate through temperature regulation, thereby maintaining operational stability despite the reduced plate thickness
3Temperature
If a thick temperature-adjusting unit is used for effective temperature control, then temperature stability is improved, but the overall module thickness increases
Solution Approach 1:
The temperature-adjusting unit is segmented into two layers positioned at different locations. This segmentation allows the unit to achieve effective temperature control through strategic positioning rather than increasing overall thickness, as each layer serves a specific thermal management function
Solution Approach 2:
Instead of increasing thickness uniformly, the upper layer portion projects in a specific direction toward the rear side of the semiconductor laser element. This dimensional strategy concentrates the temperature control function where needed without proportionally increasing the overall module thickness
4Stability of the object's composition
If the semiconductor laser element is floating-mounted, then stress from bottom plate warping is reduced, but temperature control efficiency decreases and power consumption increases
Solution Approach 1:
The lower layer portion of the temperature-adjusting unit acts as an intermediary that provides both mechanical support and thermal management. It reduces stress from bottom plate warping while maintaining efficient thermal contact, eliminating the need for floating-mounting and its associated power consumption penalties
Solution Approach 2:
The temperature-adjusting unit performs multiple functions: it provides mechanical support to reduce warping stress, enables efficient thermal contact for temperature control, and positions the semiconductor laser element correctly. This multi-functionality eliminates the need for separate floating-mounting structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables down-sizing while reducing power consumption and improving temperature control, preventing changes in laser oscillation wavelength and ensuring stable operation of the semiconductor laser element.
Implementation Method 1
a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion
Data Source
AI summary
An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.