Optical Element Package Impedance Matching

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Solution Overview

Problem

Existing optical element packages face difficulties in matching the characteristic impedance of transmission lines due to solder connections, which cause obstacles in transmitting high-frequency signals and require complex and costly assembly processes.

Innovation Solution

The optical element package design features a metal base with an eyelet and heat releasing part, through holes for lead insertion, and an insulating substrate between lead wiring portions and the heat releasing part, eliminating solder connections and allowing direct contact for improved impedance matching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductor patterns on ceramic substrate are connected to leads through solders, then electrical connection is achieved, but characteristic impedance matching becomes difficult and high frequency signal transmission is obstructed

Engineering Contradiction:

Improvecharacteristic impedance matchingVSAvoidassembly process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the solder connection layer from the signal transmission path by having the lead wiring portion directly contact the conductor pattern on the insulating substrate. This extraction of the solder interface eliminates the impedance mismatch problem caused by solder joints while maintaining electrical connectivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the lead wiring portion directly with the conductor pattern contact, eliminating the intermediate solder joint. The lead wiring portion makes direct contact with the conductor pattern, combining the connection function and transmission function into a single continuous path, thereby achieving impedance matching.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If solder connections are used to connect conductor patterns to leads, then electrical connectivity is established, but high frequency signal transmission is obstructed due to transmission parts through solders

Engineering Contradiction:

Improvehigh frequency signal transmissionVSAvoidassembly process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the solder material from the signal transmission path by designing the lead wiring portion to directly contact the conductor pattern on the insulating substrate. This removal of solder joints from the high frequency path eliminates signal obstruction while simplifying the manufacturing process.

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If complex assembly processes are used to achieve precise impedance matching, then transmission line characteristic impedance can be matched, but manufacturing cost and complexity increase

Engineering Contradiction:

Improvecharacteristic impedance matchingVSAvoidassembly process

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent enables the structure itself to achieve impedance matching through its inherent design. The direct contact between the lead wiring portion and the conductor pattern on the insulating substrate creates a continuous transmission path that naturally maintains characteristic impedance without requiring complex external adjustment mechanisms or multi-step assembly processes.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient high-frequency signal transmission with reduced reflection and assembly complexity, supporting higher-speed optical communication applications by matching the characteristic impedance of the transmission line.

Implementation Method 1

an insulating substrate disposed between the lead wiring portion and the heat releasing part

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a heat releasing part disposed on the upper surface of the eyelet

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10389084B2Optical element package and optical element device

Publication Date: 2019.08.20 SHINKO ELECTRIC IND CO LTD

AI summary

An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.