Optical End-Point Detection for IC Delayering Automation
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Solution Overview
Problem
Current IC delayering processes are time-consuming and heavily dependent on operator skill, requiring tens to hundreds of hours to fully delayer a single IC device, and are not suitable for automation due to the minute scale and complexity of modern ICs.
Innovation Solution
The use of optical end-point detection systems that utilize the color-thickness relationship of IC material layers to determine when a delayering process has reached a desired endpoint, allowing for automated control of delayering equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual delayering processes are used with skilled technicians, then manufacturing precision is maintained, but productivity is extremely low (tens to hundreds of hours per IC device)
Solution Approach 1:
The patent replaces manual mechanical delayering operations with an automated system that uses optical detection to control the delayering process. The optical end-point detection system automatically determines when to stop material removal, eliminating the need for skilled technician intervention while maintaining precision.
Solution Approach 2:
The patent implements a feedback mechanism where optical images of the IC surface are continuously monitored during delayering. The system analyzes changes in surface appearance (color, reflectivity) to detect endpoint conditions and automatically adjusts or terminates the delayering process, ensuring precision without manual intervention.
2Productivity
If automated delayering systems using mass spectroscopy and optical spectroscopy are used, then productivity increases, but device complexity and cost increase substantially
Solution Approach 1:
The patent uses simple, inexpensive optical imaging components (cameras, microscopes) and basic image processing algorithms instead of complex and expensive spectroscopic instruments. This approach achieves automation at much lower cost and complexity while maintaining acceptable productivity.
Solution Approach 2:
The patent creates optical copies (images) of the IC surface to analyze material thickness and composition indirectly, rather than using direct physical measurement methods. This copying approach simplifies the measurement system while enabling automated detection of delayering endpoints.
3Manufacturing precision
If manual delayering processes are used, then manufacturing precision is maintained, but loss of time is excessive (tens to hundreds of hours)
Solution Approach 1:
The patent enables continuous delayering operation with automatic endpoint detection, eliminating the need for intermittent manual inspection and adjustment. The system continuously monitors optical properties and maintains optimal delayering conditions throughout the process, significantly reducing total time while preserving precision.
Solution Approach 2:
The patent replaces time-consuming manual visual inspection with automated optical imaging and image analysis systems. This substitution allows rapid, objective detection of endpoint conditions without the variability and time consumption of human operators.
4Manufacturing precision
If skilled technician intervention is required for endpoint determination, then manufacturing precision is maintained, but ease of operation decreases
Solution Approach 1:
The patent implements self-service automation where the system independently performs endpoint detection using optical imaging and image analysis algorithms. No skilled technician intervention is required, as the system automatically interprets optical signals and determines when delayering should stop, maintaining precision while greatly improving ease of operation.
Solution Approach 2:
The patent uses feedback from optical imaging to automatically control the delayering process. The system continuously monitors surface characteristics and adjusts or terminates the process based on detected endpoint conditions, eliminating the need for human judgment while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and variability associated with IC delayering, enabling faster and more consistent delayering processes with minimal human intervention, thus improving efficiency and accuracy.
Implementation Method 1
The use of optical end-point detection systems that utilize the color-thickness relationship of IC material layers to determine when a delayering process has reached a desired endpoint
Data Source
AI summary
Systems for determining an end-point of a delayering process using optical end-point detection are described. In embodiments, the systems include a controller with an optical end-pointing (OE) module that is configured to determine an end-point of a delayering process based at least in part on the color or thickness of a surface layer of an integrated circuit (IC). In embodiments, the OE module determines whether an end-point of the delayering process has been reached based at least in part on a comparison of a determined thickness of an IC surface layer to a target thickness. The thickness of the surface layer may be determined by the OE module using a machine learning model, such as a convolutional neural network. Methods of identifying an end-point of a delayering process are also described.