Optical-Engine Interconnect for High-Bandwidth Die-to-Die Signaling

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Solution Overview

Problem

The communication speed and bandwidth between device dies and packages in integrated circuits are limited by the use of copper wires, which suffer from high cross-talk and interference, hindering high-performance applications.

Innovation Solution

Implementing an optical-engine based interconnect component that converts electrical signals to optical signals for transfer between package components, using a photonic die and electronic die bonded together, thereby reducing cross-talk and interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If copper wires are used for signal communication between device dies and packages, then the communication infrastructure is simple and cost-effective, but the communication speed and bandwidth are limited and cross-talk and interference are high

Engineering Contradiction:
Improvecommunication speedVSAvoidcross-talk and interference
Core Design Contradiction:
SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent substitutes electrical signal transmission through copper wires with optical signal transmission through waveguides. The optical engine converts electrical signals to optical signals that travel through dielectric waveguides, eliminating the electromagnetic interference and cross-talk inherent in copper wire systems while providing higher bandwidth and speed capability

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an optical engine as an intermediary component between device dies. This optical engine includes electrical-to-optical converters and optical-to-electrical converters that mediate the signal transmission process, enabling high-speed communication while isolating the device dies from direct electrical interconnection and its associated interference

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If copper wires are used for signal communication, then the device complexity is low, but the bandwidth is limited

Engineering Contradiction:
ImprovebandwidthVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces the simple copper wire interconnect system with an optical transmission system using waveguides and optical engines. Although this increases device complexity by adding optical components, it provides exponentially higher bandwidth capability that enables high-performance computing applications requiring massive data throughput

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The bandwidth of signal communication is enhanced, and cross-talk and interference are minimized, enabling high-speed and high-bandwidth signal transfer.

Implementation Method 1

The optical-engine based interconnect component converts electrical signals to optical signals, which are transferred toward a second package component

Methodology Applied
Scientific EffectElectrical-to-optical conversion: Light Emitting Diode

Implementation Method 2

The optical signals are converted back to the electrical signals before providing to the second package component

Methodology Applied
Scientific EffectOptical-to-electrical conversion: Photoelectric Effect

Data Source

PatentUS20250355168A1Signal communication through optical-engine based interconnect component
Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250355168A1 patent drawing
  • US20250355168A1 patent drawing
  • US20250355168A1 patent drawing

AI summary

A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.