Optical Engine Heat Dissipation via External Conduction Path
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Solution Overview
Problem
Current projectors face overheating issues due to inadequate heat dissipation at the front end of the light valve, leading to reduced service life and excessive noise from increased heat dissipation module volume and fan speed, as well as internal stress from temperature differences.
Innovation Solution
An optical engine module with a housing, assembling element, and first heat exchange assembly, where the assembling element is assembled in a non-direct contact mode with the housing, and the first heat exchange assembly includes heat conduction components and dissipation fins to effectively dissipate heat generated by the light valve, reducing heat transmission and improving dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the volume of heat dissipation module is increased, then heat dissipation efficiency is improved, but the volume of projector is greatly increased
Solution Approach 1:
The patent introduces a new spatial dimension by extending the heat conduction component from the assembling element to the outside of the housing. This creates an external heat dissipation pathway that utilizes space outside the projector body, thereby improving heat dissipation efficiency without increasing the internal volume of the projector.
Solution Approach 2:
The heat dissipation function is segmented into two parts: internal heat generation at the light valve, and external heat dissipation through the extending heat conduction component. This segmentation allows heat to be dissipated outside the main projector body, separating the heat generation zone from the heat dissipation zone spatially.
2Temperature
If the rotation speed of heat dissipation fan is increased, then heat dissipation efficiency is improved, but noise is excessively increased
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional fan-based internal system and relocates it to an external heat conduction component that extends outside the housing. This extraction eliminates or reduces the need for high-speed internal fans, thereby reducing noise while maintaining heat dissipation efficiency.
Solution Approach 2:
The heat conduction component serves as an intermediary that transfers heat from the light valve through the assembling element to the external environment. This intermediary structure provides a passive heat transfer pathway that reduces reliance on active fan-based convection, thereby lowering noise levels.
3Device complexity
If heat dissipation module is only disposed at rear end of light valve, then structure is simplified, but front end of light valve cannot be subjected to effective heat dissipation
Solution Approach 1:
The patent extends the heat dissipation coverage to a new dimension by adding an external heat conduction pathway that reaches outside the housing. This allows heat from the front end of the light valve to be conducted outward for dissipation, complementing the existing rear-end heat dissipation and achieving comprehensive thermal management without significantly increasing structural complexity.
4Temperature
If heat dissipation is improved by increasing module volume, then heat dissipation efficiency is improved, but internal stress is caused due to excessive temperature difference
Solution Approach 1:
The patent extracts heat from the light valve region through the heat conduction component and transfers it outside the housing for dissipation. This extraction of heat from the critical region reduces the temperature gradient between different parts of the light valve, thereby minimizing thermal stress and preventing deformation while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation at the front end of the light valve, reducing internal stress and extending its service life while maintaining better projection quality without increasing the projector's volume or noise levels.
Implementation Method 1
The first heat conduction component extends from the assembling element to the outside of the housing and is connected with the first heat dissipation fin set
Implementation Method 2
The first heat dissipation fin set is located outside the housing
Implementation Method 3
The first heat dissipation fin set is located outside the housing
Data Source
AI summary
An optical engine module includes a housing, an assembling element, a light valve and a first heat exchange assembly. The assembling element has an opening corresponding to an assembly hole of the housing and is assembled on the housing in a non-direct contact mode. The light valve includes a base and an imaging element. The base bears against the assembling element, and an imaging surface of the imaging element faces the opening. The housing, the assembling element and the light valve define a chamber. The first heat exchange assembly is disposed on the assembling element and includes at least one first heat conduction component and a first heat dissipation fin set. The first heat dissipation fin set is located outside the housing. The first heat conduction component extends from the assembling element to the outside of the housing and is connected with the first heat dissipation fin set.