Optical Engine Integrating Optoelectronics and Switching Circuitry
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Solution Overview
Problem
Existing optical transceivers are packaged in large sizes, leading to increased system size and power consumption due to the need for significant electrical transceiver circuitry for high-speed communications, which results in inefficient placement and energy usage.
Innovation Solution
The optical engine design includes an electronic interfacing component with through-silicon vias and a silicon integrated circuit, featuring a transistor circuit and opto-electronic devices like photodetectors and modulators, with conductive paths of less than 500 microns in length, and a silicon photonics integrated circuit, to reduce electrical path lengths and improve packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical transceivers are packaged in large packages and placed far from electrical switching circuitry, then electrical connections can be established, but the overall system size increases and power consumption increases
Solution Approach 1:
The patent combines the optical transceiver components and electrical switching circuitry into a single integrated optical engine package. The electrical switching circuitry is placed on the same substrate as the optical components, eliminating the need for separate packaging and distant electrical connections. This merging of previously separate components resolves the contradiction by reducing system size while maintaining electrical connection reliability through short on-package traces.
2Reliability
If optical transceivers are packaged in large packages and placed far from electrical switching circuitry, then electrical connections can be established, but power consumption increases due to high-speed electrical communications
Solution Approach 1:
By integrating the electrical switching circuitry directly on the optical engine substrate, the patent dramatically shortens the electrical signal paths. This reduction in transmission distance lowers the power required for high-speed electrical communications while maintaining signal integrity and connection reliability.
3Use of energy by stationary object
If electrical path lengths are reduced by integrating opto-electronic devices closer to the silicon photonics integrated circuit, then power consumption decreases, but packaging complexity increases
Solution Approach 1:
The patent resolves the packaging complexity issue by merging all components - the silicon photonics integrated circuit, opto-electronic devices, and electrical switching circuitry - onto a single substrate. This monolithic integration eliminates the need for complex multi-component packaging arrangements while enabling short electrical paths and reduced power consumption.
Solution Approach 2:
The patent utilizes three-dimensional vertical stacking and layered substrate architecture to accommodate multiple functional components in a compact footprint. By organizing components in vertical layers rather than spreading them horizontally, the design achieves short electrical paths without increasing lateral packaging complexity.
Data Source
AI summary
An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.