Optical Engine Reflective Layout for Thermal-Slim Photonic Packaging
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Solution Overview
Problem
Existing semiconductor packages face challenges in improving thermal properties and performance while maintaining miniaturization.
Innovation Solution
The optical engine device incorporates an electronic integrated circuit (EIC) chip with a photonic chip featuring a reflective pattern on an inclined upper surface, spaced apart from the sidewall, and a fiber optic device on the sidewall, along with a redistribution substrate and interposer substrate design to enhance thermal management and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the photonic chip uses a flat upper surface with the reflective pattern close to the sidewall, then the device area is reduced, but the optical performance and thermal properties deteriorate
Solution Approach 1:
The photonic chip employs an asymmetric upper surface design where one portion is inclined at an angle (e.g., 45 degrees) while another portion remains flat. This asymmetric configuration allows the reflective pattern to be positioned on the inclined surface, optimizing optical reflection paths and thermal dissipation without compromising device area efficiency.
Solution Approach 2:
The reflective pattern is positioned at a vertical distance from the sidewall rather than being placed immediately adjacent to it. This vertical spacing on the inclined surface creates additional optical paths and improves thermal management by separating the reflective function from the structural boundary, thereby enhancing optical performance without significantly increasing the horizontal footprint.
2Volume of moving object
If the reflective pattern is positioned close to the sidewall, then the device is miniaturized, but thermal management performance deteriorates
Solution Approach 1:
The inclined upper surface creates an asymmetric thermal pathway that directs heat away from the sidewall region. By positioning the reflective pattern on the inclined surface at an optimized vertical distance from the sidewall, heat generated in the photonic chip can be more effectively dissipated through the substrate without being constrained by proximity to the sidewall, thus improving thermal management while maintaining compact dimensions.
3Ease of manufacture
If the photonic chip structure is simplified, then manufacturing is easier, but optical performance deteriorates
Solution Approach 1:
The inclined upper surface is formed using standard semiconductor fabrication techniques such as selective etching or anisotropic etching, which are well-established processes. This approach introduces the necessary asymmetry for optimal optical performance without requiring complex additional manufacturing steps, thereby maintaining ease of manufacture while achieving superior optical reflection characteristics.
Solution Approach 2:
The inclination angle of the upper surface is optimized to specific values (e.g., 45 degrees) to maximize optical reflection efficiency. By carefully controlling this geometric parameter during fabrication, the patent achieves enhanced optical performance using conventional manufacturing processes, balancing manufacturing simplicity with optical effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved thermal properties and miniaturization of the semiconductor package by optimizing the layout and alignment of components, enhancing performance and reducing thickness.
Implementation Method 1
a reflective pattern on the inclined upper surface of the photonic chip substrate, and where at least a portion of the reflective pattern is horizontally spaced apart from the first photonic chip sidewall
Data Source
AI summary
An optical engine device includes an electronic integrated circuit (EIC) chip, and a photonic chip on the EIC chip, where the PIC chip includes a first photonic chip sidewall, a photonic chip substrate having an inclined upper surface, and a reflective pattern on the inclined upper surface of the photonic chip substrate, and where at least a portion of the reflective pattern is horizontally spaced apart from the first photonic chip sidewall.