Optical Interface Engine Packaging for High-I/O Signal Integrity
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Solution Overview
Problem
Integrated circuits with high functionality require many input/output pads, necessitating small packages for miniaturization while maintaining high-speed, reliable communication, which is challenging with existing packaging technologies.
Innovation Solution
The integration of an optical interface engine on the semiconductor substrate, placed over an interposer near semiconductor devices, converts electrical signals to optical signals for faster communication and reduces signal deterioration by minimizing distance between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of input/output pads is increased to achieve high functionality, then the functionality of integrated circuits is improved, but the package size increases which contradicts miniaturization requirements
Solution Approach 1:
An interposer is introduced as an intermediary component between the semiconductor device and the package substrate. The interposer provides additional routing layers and redistribution of signals, allowing multiple I/O pads to be accessed through a smaller footprint on the package substrate. This mediator enables high functionality without directly increasing the overall package size.
Solution Approach 2:
The patent utilizes vertical stacking and multi-layer routing in the interposer to increase I/O capacity. By adding depth and utilizing three-dimensional routing paths rather than only planar expansion, the system achieves higher functionality while maintaining a compact two-dimensional package footprint.
2Productivity
If electrical signals are transmitted over longer distances between components, then more components can be integrated, but signal deterioration and noise increase
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission for certain communication paths. Optical signals are used to transmit data between the semiconductor device and external systems, eliminating electrical interference and signal deterioration issues. This substitution maintains signal quality while enabling longer transmission distances and higher integration density.
3Area of stationary object
If package size is reduced for miniaturization, then portability is improved, but providing high-speed reliable communication becomes more difficult
Solution Approach 1:
The interposer serves as a mediator that enables high-speed communication within a compact package. It provides controlled impedance routing, signal equalization, and differential pair routing that maintains signal integrity even in a reduced-size package configuration.
Solution Approach 2:
Optical interfaces are used to replace electrical interfaces for external communication, enabling high-speed data transmission while maintaining a small package size. The optical engine integrated on the semiconductor device converts electrical signals to optical signals for transmission, avoiding the limitations of electrical signal degradation in compact packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances communication speed and reduces noise by utilizing fiber optics, ensuring reliable electrical communication between semiconductor devices and other systems.
Implementation Method 1
The optical interface engine may receive the electrical signals of the plurality of the semiconductor devices through the semiconductor substrate. The OI engine may convert the electrical signals to optical signals
Implementation Method 2
The OI engine may transmit the optical signals through an optical communication conduit to the other systems
Data Source
AI summary
A semiconductor package includes an interposer that has a first side and a second side opposing the first side. A semiconductor device that is on the first side of the interposer and an optical device that is on the first side of the interposer and next to the semiconductor device. A first encapsulant layer includes a first portion and a second portion. The first portion of the first encapsulant layer is on the first side of the interposer and along sidewalls of the semiconductor device. A gap is between a first sidewall of the optical device and a second sidewall of the first portion of the first encapsulant layer. A substrate is over the second side of the interposer. The semiconductor device and the optical device are electrically coupled to the substrate through the interposer.